Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-28T15:30:28.193Z Has data issue: false hasContentIssue false
  • English
  • Français

Thermal Transport Properties of Ag-Based Nanocomposites Containing MWCNTs

Published online by Cambridge University Press:  13 February 2012

M. Inoue ,
Y. Hayashi  and
H. Takizawa
M. Inoue
Affiliation:
The Institute of Scientific and Industrial Research, Osaka University, 8-1 Mihogaoka, Ibaraki, Osaka 567-0047, Japan
Y. Hayashi
Affiliation:
Graduate School of Engineering, Tohoku University, 6-6-07 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan
H. Takizawa
Affiliation:
Graduate School of Engineering, Tohoku University, 6-6-07 Aoba, Aramaki, Aoba-ku, Sendai, Miyagi 980-8579, Japan
Get access

Abstract

Variation in thermal conductivity of Ag-based composites by introduction of multi-walled carbon nanotubes (MWCNTs) was investigated. The Ag/MWCNT nanocomposite powder was successfully prepared when appropriate surfactants were used via a sonoprocess. The nanocomposite powder was subsequently cured at 280-300 ºC in air. After curing, the thermal conductivity of the nanocomposites was compared with the electronic contribution to thermal conductivity that was estimated from experimental values of the electrical conductivity. The thermal conductivity of Ag/MWCNT nanocomposites was much higher than the electronic contribution. Therefore, the increase in thermal conductivity of the Ag-based nanocomposites is attributed to phonon transfer along the percolation network of MWCNTs.

Keywords

thermal conductivitycompositesintering
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1404: Symposium W – Phonons in Nanomaterials–Theory, Experiments and Applications , 2012 , mrsf11-1404-w08-07
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ide, E., Angata, S., Hirose, A., Kobayashi, K. F., Acta Mater., 53, 2385 (2005).Google Scholar
2. Bai, J., Zhang, Z., Calata, J., Lu, G.-Q., IEEE Trans. Comp. Packaging Technol., 29, 589 (2006).Google Scholar
3. Morita, T., Yasuda, Y., Ide, E., Akada, Y., Hirose, A., Mater. Trans., 49, 2875 (2008).Google Scholar
4. Kuramoto, M., Ogawa, S., Niwa, M., Kim, K.-S., Suganuma, K., IEEE Trans. Comp. Packaging Technol., 33, 801 (2010).Google Scholar
5. Yamada, T., Hayashi, Y., Takizawa, H., Mater. Trans., 51 (2010) 1769.Google Scholar
6. Sandlera, J., Shaffera, M.S.P., Prasseb, T., Bauhoferb, W., Schultea, K., Windlea, A.H., Polymer, 40, 5967 (1999)Google Scholar
7. Ashcroft, N. W., Mermin, N. D., “Solid State Physics”, (Holt, Rinehart and Winston, 1976)Google Scholar