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Temperature Dependence of Stresses and H Desorption in Porous Silicon

Published online by Cambridge University Press:  28 February 2011

Y. Diawara
Affiliation:
Ecole Polytechnique, Département de génie physique, Groupe des Couches Minces, C.P.6079, Succ. Centre-Ville, Montréal, Qc, Canada, H3C 3A7.
J.F. Currie
Affiliation:
Ecole Polytechnique, Département de génie physique, Groupe des Couches Minces, C.P.6079, Succ. Centre-Ville, Montréal, Qc, Canada, H3C 3A7.
A. Yelon
Affiliation:
Ecole Polytechnique, Département de génie physique, Groupe des Couches Minces, C.P.6079, Succ. Centre-Ville, Montréal, Qc, Canada, H3C 3A7.
V. Petrova-Koch
Affiliation:
Physik-Department E 16, Tech. Univ. Munchen, 8046 Garching, Germany.
A. Nikolov
Affiliation:
Physik-Department E 16, Tech. Univ. Munchen, 8046 Garching, Germany.
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Abstract

The mechanical stress induced in as-prepared porous silicon is generally compressive. Upon thermal annealing, the stress shows hysteresis. Isothermal annealing reveals second-order kinetic processes for both the stress and hydrogen effusion. The correlations between the changes in stress and porous silicon composition and structure are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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References

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