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TEM Observations on the Evolution of Grain Structure in Pressurized Al-0.5Cu Thin Films

Published online by Cambridge University Press:  10 February 2011

H.D. Yang ,
C.-U. Kim ,
M. Saran  and
H.A. Le
H.D. Yang
Affiliation:
Materials Science and Engineering, University of Texas, Arlington, TX 76019
C.-U. Kim
Affiliation:
Materials Science and Engineering, University of Texas, Arlington, TX 76019
M. Saran
Affiliation:
Texas Instruments, Inc., MS 374, 13353 Floyd Rd., Dallas, TX 75243
H.A. Le
Affiliation:
Texas Instruments, Inc., MS 374, 13353 Floyd Rd., Dallas, TX 75243
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Abstract

This paper reports the observations of the grain-refining mechanism found in Al-0.5Cu thin films that are subjected to hydrostatic compressive pressure during the annealing process. The films are deposited on Si substrates and subsequently placed under 60 MPa Ar gas pressure at 400°C. Transmission electron microscopy on these films reveals that plastic deformation occurs by dislocation slip and induces a refined grain structure. Polygonization is the primary mechanism for grain refining, resulting in the formation of sub-grain boundaries.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 516: Symposium E – Low Dielectric Constant Materials IV , January 1998 , 121
Copyright
Copyright © Materials Research Society 1998

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