Hostname: page-component-78c5997874-j824f Total loading time: 0 Render date: 2024-11-02T23:30:47.675Z Has data issue: false hasContentIssue false

Stretched Polymer Nanohairs by Tailored Capillarity and Adhesive Force

Published online by Cambridge University Press:  01 February 2011

Hoon Eui Jeong
Affiliation:
[email protected], Seoul National University, aSchool of Mechanical and Aerospace Engineering, Seoul National University, San 56-1, Sillim-Dong, Kwanak-Gu, Seoul, 151-742, Korea, Republic of
Sung Hoon Lee
Affiliation:
[email protected], Seoul National University, School of Mechanical and Aerospace Engineering, Seoul, 151-742, Korea, Republic of
Pilnam Kim
Affiliation:
[email protected], Seoul National University, School of Mechanical and Aerospace Engineering, Seoul, 151-742, Korea, Republic of
Kahp Y. Suh
Affiliation:
[email protected], Seoul National University, School of Mechanical and Aerospace Engineering, Seoul, 151-742, Korea, Republic of
Get access

Abstract

We present a simple method for fabricating high aspect-ratio polymer nanostructures on a solid substrate by sequential application of molding and drawing of a thin polymer film. In this method, a thin polymer film is prepared by spin coating on a solid substrate and the temperature is raised above the polymer¡¯s glass transition while in conformal contact with a poly(urethane acrylate) (PUA) mold having nano-cavities. Consequently, capillary forces induces deformation of the polymer melt into the void spaces of the mold and the filled nanostructure was further elongated upon removal of the mold due to tailored adhesive force at the mold/polymer interface. The optimum value of the work of adhesion at the mold/polymer interface ranged from 0.9 to 1.1 times that at the substrate/polymer interface. Below or above this range, a simple molding or detachment occurred, corresponding to earlier findings.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Aimi, M.F., Rao, M.P., Macdonald, N.C., Zuruzi, A.S. and Bothman, D.P., Nat. Mater. 3, 103105 (2004).Google Scholar
2. Jang, J.E., Cha, S.N., Choi, Y., Amaratunga, G.A.J., Kang, D.J., Hasko, D.G., Jung, J.E. and Kim, J.M., Appl. Phys. Lett. 87, 87 (2005).Google Scholar
3. Rangelow, I.W. and Biehl, S., J Vac Sci Technol B 19, 916919 (2001).Google Scholar
4. Tan, J.L., Tien, J., Pirone, D.M., Gray, D.S., Bhadriraju, K. and Chen, C.S., Proc. Natl Acad. Sci. U.S.A. 100, 14841489 (2003).Google Scholar
5. Geim, A.K., Dubonos, S.V., Grigorieva, I.V., Novoselov, K.S., Zhukov, A.A. and Shapoval, S.Y., Nature Materials 2, 461463 (2003).Google Scholar
6. Sitti, M. and Fearing, R.S., J. Adhes. Sci. Technol. 17, 10551073 (2003).Google Scholar
7. Yurdumakan, B., Raravikar, N.R., Ajayan, P.M. and Dhinojwala, A., Chemical Communications 3799–3801 (2005).Google Scholar
8. Madou, M.J., Fundamentals of microfabrication : the science of miniaturization, 2nd ed., CRC Press, Boca Raton, Fla., (2002).Google Scholar
9. Chou, S.Y., Krauss, P.R. and Renstrom, P.J., Science 272, 8587 (1996).Google Scholar
10. Xia, Y.N. and Whitesides, G.M., Annu. Rev. Mater. Sci. 28, 153184 (1998).Google Scholar
11. Hui, C.Y., Jagota, A., Lin, Y.Y. and Kramer, E.J., Langmuir 18, 13941407 (2002).Google Scholar
12. Bietsch, A. and Michel, B., J. Appl. Phys. 88, 43104318 (2000).Google Scholar
13. Choi, S.J., Yoo, P.J., Baek, S.J., Kim, T.W. and Lee, H.H., J. Am. Chem. Soc. 126, 77447745 (2004).Google Scholar
14. Suh, D., Choi, S.J. and Lee, H.H., Adv. Mater. 17, 15541560 (2005).Google Scholar
15. Suh, K.Y., Kim, Y. S. and Lee, H. H., Adv. Mater. 17, 560564 (2005).Google Scholar
16. Stutzmann, N., Tervoort, T.A., Bastiaansen, K. and Smith, P., Nature 407, 613616 (2000).Google Scholar
17. Kim, C., Burrows, P.E. and Forrest, S.R., Science 288, 831833 (2000).Google Scholar
18. Choi, J.H., Kim, D., Yoo, P.J. and Lee, H.H., Adv. Mater. 17, 166-+ (2005).Google Scholar