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Solid Bridging during Pattern Collapse (Stiction) Studied on Silicon Nanoparticles

Published online by Cambridge University Press:  01 March 2011

Daniel Peter ,
Michael Dalmer ,
Andriy Lotnyk ,
Lorenz Kienle ,
Alfred Lechner  and
Wolfgang Bensch
Daniel Peter
Affiliation:
Lam Research Corporation, SEZ Str. 1, 9500 Villach, Austria
Michael Dalmer
Affiliation:
Lam Research Corporation, SEZ Str. 1, 9500 Villach, Austria
Andriy Lotnyk
Affiliation:
Institute for Material Science, Christian-Albrechts-Universität Kiel, Kaiserstr. 2, 24143 Kiel, Germany
Lorenz Kienle
Affiliation:
Institute for Material Science, Christian-Albrechts-Universität Kiel, Kaiserstr. 2, 24143 Kiel, Germany
Alfred Lechner
Affiliation:
Microsystems Engineering, University of Applied Sciences Regensburg, Seybothstr. 2, 93049 Regensburg, Germany
Wolfgang Bensch
Affiliation:
Inorganic Chemistry, Christian-Albrechts-Universität, Max-Eyth-Str. 2, 24118 Kiel, Germany
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Abstract

The high surface to volume ratio of nanoparticles allows a detailed experimental study of the surface phenomena associated with solid bridging. Besides bulk analyses, the local view on the structure and composition via HRTEM is particularly essential. 50 nm core shell particles consisting of a silicon (Si) core and a SiO2 shell were used as model system to understand surface phenomena appearing for Si-based nanostructures. Evaporative drying from de-ionized water shows the most significant bridging effect based on SiO2. There is only a localized deposition of oxides between the particles during the drying process and no overall oxidation. For the deposition material, silicates are the most likely candidates.

Keywords

core/shellnanoscalemicroelectronics
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1299: Symposium S – Microelectromechanical Systems—Materials and Devices IV , 2011 , mrsf10-1299-s09-29
Copyright
Copyright © Materials Research Society 2011

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References

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