Hostname: page-component-78c5997874-94fs2 Total loading time: 0 Render date: 2024-11-02T23:10:35.865Z Has data issue: false hasContentIssue false
  • English
  • Français

The Role of Thermal Radiative Properties of Semiconductor Wafers in Rapid Thermal Processing

Published online by Cambridge University Press:  10 February 2011

P. J. Timans
P. J. Timans*
Affiliation:
AG Associates, 4425 Fortran Drive, San Jose, CA 95134-2300.
Get access

Abstract

Rapid thermal processing (RTP) has become a key technology in the fabrication of advanced semiconductor devices. As RTP becomes the accepted technique for an increasingly wide range of processes in device fabrication, the understanding of the basic physics of radiation heat transfer in RTP systems is also being extended rapidly. This paper illustrates the use of optical models for prediction of the thermal radiative properties of semiconductor wafers. Such calculations can be used to address many of the key issues of interest in RTP, including questions concerning temperature measurement and process repeatability.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 429: Symposium N – Rapid Thermal and Integrated Processing V , 1996 , 3
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Timans, P. J., in Advances in Rapid Thermal and Integrated Processing edited by Roozeboom, F. (Kluwer Academic Publishers, Dordrecht, 1996), pp. 35–102.Google Scholar
2. Hill, C., Jones, S. and Boys, D., in Reduced Thermal Processing for ULSI, edited by Levy, R. A. (Plenum Press, New York, 1989), pp. 143–180.Google Scholar
3. Erofeev, A. F., Kolpakov, A. V., Makhviladze, T. M., Martjushenko, A. V., Panjukhin, A. V., Volchek, O. S. and Orlowski, M., in Rapid Thermal Processing '95, edited by Fair, R. B. and Lojek, B. (RTP'95, Round Rock, 1995), pp 181–197.Google Scholar
4. Hebb, J. P. and Jensen, K. F., J. Electrochem. Soc. 143, 1142 (1996).Google Scholar
5. Edwards, D. F., in Handbook of Optical Constants of Solids, edited by Palik, E. D. (Academic Press, Orlando, 1985), pp. 547–569.Google Scholar
6. Timans, P. J., J. Appl. Phys. 74, 6353 (1993).Google Scholar
7. Timans, P. J., in Rapid Thermal Processing '93, edited by Fair, R. B. and Lojek, B. (RTP'93, Scottsdale, 1993), pp. 282–6.Google Scholar
8. Macfarlane, G. G., McLean, T. P., Quarrington, J. E. and Roberts, V., Phys. Rev. 111, 1245 (1958).Google Scholar
9. Jellison, G. E. Jr and Lowndes, D. H., Appl. Phys. Lett. 41, 594 (1982).Google Scholar
10. Vandenabeele, P. and Maex, K., J. Appl. Phys. 72, 5867 (1992).Google Scholar
11. Sturm, J. C. and Reaves, C. M., IEEE Trans. Electron Devices 39, 81 (1992).Google Scholar
12. Kessler, F. R. and Schnell, J., Z. Naturforsch. 13 a, 458 (1958).Google Scholar
13. Sato, T., Jpn. J. Appl. Phys. 6, 339 (1967).Google Scholar
14. Li, H. H., J. Phys. Chem. Ref. Data 9, 561 (1980).Google Scholar
15. Magunov, A. N., Opt. Spectrosc. 73 205 (1992).Google Scholar
16. McCaulley, J. A., Donnelly, V. M., Vernon, M. and Taha, I., Phys. Rev. B 49, 7408 (1994).Google Scholar
17. Jellison, G. E. Jr and Modine, F. A., J. Appl. Phys. 76, 3758 (1994).Google Scholar
18. Timans, P. J., J. Appl. Phys. 72, 660 (1992).Google Scholar
19. Thermophysical Properties of Matter, Vol. 7, Thermal Radiative Properties: Metallic Elements and Alloys, edited by Touloukian, Y. S. and de Witt, D. P. (IFI/Plenum, New York, 1970).Google Scholar
20. Thermophysical Properties of Matter, Vol. 8, Thermal Radiative Properties: Non-Metallic Solids, edited by Touloukian, Y. S. and de Witt, D. P. (IF/Plenum, New York, 1972).Google Scholar
21. Wong, J., J. Electronic Materials 5, 113 (1976).Google Scholar
22. Macleod, H. A., Thin Film Optical Filters, (McGraw-Hill, New York, 1986) pp. 11–48.Google Scholar
23. Gardon, R., J. Am. Ceram. Soc. 39, 278 (1956).Google Scholar
24. Richmond, J. C., J. Opt. Soc. Amer. 56, 253 (1966).Google Scholar
25. Torrance, K. E. and Sparrow, E. M., Int. J. Heat Mass Transfer 10, 1709 (1967).Google Scholar
26. Caren, R. P. and Liu, C. K., Trans. ASME Series C - J. Heat Transfer, 94, 73 (1972).Google Scholar
27. Siegel, R. and Howell, J. R., Thermal Radiation Heat Transfer, 3rd edition (Hemisphere Publishing Corporation, Washington, 1992) p. 120.Google Scholar
28. Xu, H. and Sturm, J. C., Mat. Res. Soc. Symp. Proc. 387, 29 (1995).Google Scholar
29. Yablonovitch, E., J. Opt. Soc. Amer. 72, 899 (1982).Google Scholar
30. Timans, P. J., in Rapid Thermal Processing '94, edited by Fair, R. B. and Lojek, B. (RTP'94, Round Rock, 1994), pp. 186–93.Google Scholar
31. Pettibone, D. W., Suarez, J. R. and Gat, A., Mat. Res. Soc. Symp. Proc. 52, 209 (1986).Google Scholar
32. Wong, P. Y., Miaoulis, I. N. and Madras, C. G., Mat. Res. Soc. Symp. Proc. 387, 15 (1995).Google Scholar
33. Nakos, J. S., in Rapid Thermal Processing '93, edited by Fair, R. B. and Lojek, B. (RTP'93, Scottsdale, 1993), pp. 421–8.Google Scholar
34. Pfeifer, K. and Roche, B., in Rapid Thermal Processing '95, edited by Fair, R. B. and Lojek, B. (RTP'95, Round Rock, 1995), pp. 319–324.Google Scholar
35. Vandenabeele, P. and Maex, K., Proc. SPIE 1393, 316 (1990).Google Scholar
36. Takeuti, D. F., Timans, P. J. and Ahmed, H., Appl. Phys. Lett. 67, 2206 (1995).Google Scholar