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Reductions in the Lattice Thermal Conductivity of Ball-milled and Shock compacted TiNiSn1−XSbX Half-Heusler alloys

Published online by Cambridge University Press:  21 March 2011

S. Bhattacharya
Affiliation:
Department of Physics and Astronomy, Clemson University, Clemson, SC, USA
Y. Xia
Affiliation:
Department of Physics, University of Virginia, Charlottesville, VA, USA
V. Ponnambalam
Affiliation:
Department of Physics, University of Virginia, Charlottesville, VA, USA
S.J. Poon
Affiliation:
Department of Physics, University of Virginia, Charlottesville, VA, USA
N. Thadani
Affiliation:
Department of Material Science and Engineering, Georgia Institute of Technology, Atlanta, GA
T.M. Tritt
Affiliation:
Department of Physics and Astronomy, Clemson University, Clemson, SC, USA
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Abstract

Half-Heusler alloys are currently being investigated for their potential as thermoelectric materials [1], [2]. They exhibit high negative thermopower (40-250μV/K) and favorable electrical resistivity (0.1-8mW•cm) at room temperature. Attractive power factors (α2σT) of about (0.2-1.0W/m•K) at room temperature and about 4W/m•K at 600K [3] have been reported in these materials. But in order to achieve a high figure-of-merit in the half-Heusler alloys, the relatively high thermal conductivity in these materials (∼ 10 W/m•K) must be reduced. The thermal conductivity in these materials is composed of mainly a lattice contribution, compared to a very small electronic component. The challenge is to reduce the relatively high lattice thermal conductivity in these materials. Reported in this paper is a significant reduction of lattice thermal conductivity (∼1.5 - 3.5W/m•K) in some Ti-based half-Heusler alloys. Samples have been prepared by ball milling and followed by shock-compaction that has resulted into reduced grain sizes in these materials. The effects of the microstructure on the thermal transport properties of the Half-Heusler alloys have been investigated and are presented and discussed herein.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

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