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Real-time Control System for Improved CMP Pad Profiles

Published online by Cambridge University Press:  01 February 2011

Gregory E Menk ,
Sivakumar Dhandapani ,
Charles Chad Garretson ,
Shou-Sung Chang ,
Christopher Cocca ,
Jason Fung ,
Jun Qian  and
Stan Tsai
Gregory E Menk
Affiliation:
[email protected]
Sivakumar Dhandapani
Affiliation:
[email protected], Applied Materials, SSG/CMP, Sunnyvale, California, United States
Charles Chad Garretson
Affiliation:
[email protected], Applied Materials, SSG/CMP, Sunnyvale, California, United States
Shou-Sung Chang
Affiliation:
[email protected], Applied Materials, SSG/CMP, Sunnyvale, California, United States
Christopher Cocca
Affiliation:
[email protected]
Jason Fung
Affiliation:
[email protected], Applied Materials, SSG/CMP, Sunnyvale, California, United States
Jun Qian
Affiliation:
[email protected], Applied Materials, SSG/CMP, Sunnyvale, California, United States
Stan Tsai
Affiliation:
[email protected], Applied Materials, SSG/CMP, Sunnyvale, California, United States
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Abstract

Chemical mechanical planarization (CMP) pads require conditioning to maintain the surfaces yielding optimal performance. However, conditioning not only regenerates the pad surface but also wears away the pad material and slurry transport grooves. Non-optimized conditioning may result in non-uniform pad profiles, limiting the productive lifetimes of pads. A new approach to conditioning uses closed-loop control (CLC) of conditioning sweep to enable uniform groove depth removal across the pad, throughout pad life. A sensor integrated into the conditioning arm enables the pad stack thickness to be monitored in situ and in real time. Feedback from the thickness sensor is used to modify pad conditioner dwell times across the pad surface, correcting for drifts in the pad profile that may arise as the pad and disk age. Pad profile CLC enables uniform reduction in groove depth with continued conditioning, providing longer consumables lifetimes and reduced operating costs.

Keywords

diamondtribologyoxide
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-E02-02
Copyright
Copyright © Materials Research Society 2010

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References

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