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Rapid Prototyping of Glass Microfluidic Devices using Femtosecond Laser Pulses

Published online by Cambridge University Press:  15 March 2011

Myung-Il Park ,
Jun Rye Choi ,
Mira Park ,
Dae Sik Choi ,
Sae Chae Jeoung  and
Chong-Ook Park
Myung-Il Park
Affiliation:
Department of Material Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Kusong-dong, Yuseong-gu, Daejeon, Republic of, Korea
Jun Rye Choi
Affiliation:
Laser Metrology Laboratory, Korea Research Institute of Standards and Science, POB 102 Yuseong-gu, Daejeon, Republic of, Korea
Mira Park
Affiliation:
National Creative Research Initiatives Center for Ultrafast Optical Characteristics Control & Department of Chemistry, Yonsei University, Seoul 120-749, Republic of, Korea
Dae Sik Choi
Affiliation:
Laser Metrology Laboratory, Korea Research Institute of Standards and Science, POB 102 Yuseong-gu, Daejeon, Republic of, Korea
Sae Chae Jeoung
Affiliation:
Laser Metrology Laboratory, Korea Research Institute of Standards and Science, POB 102 Yuseong-gu, Daejeon, Republic of, Korea
Chong-Ook Park
Affiliation:
Department of Material Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Kusong-dong, Yuseong-gu, Daejeon, Republic of, Korea
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Abstract

Laser micromachining technology with 150 femtosecond pulses is developed to fabricate glass microfluidic devices. A short theoretical analysis of femtosecond laser ablation is reported to characterize the femtosecond laser micromachining. The ablated crater diameter is measured as a function of the number of laser pulses as well as laser fluence. Two different ablation regimes are observed and the transition between the regimes is dependent on both the laser fluence and the number of laser shots. Based on the ablation phenomena described, microfluidic devices are fabricated with commercially available soda lime glasses (76 mm × 26 mm × 1 mm, Knittel Glaser, Germany). In addition to a microchannel for microfluidics, the capillary as well as optical fiber for detecting is integrated on the same substrate. The substrate is successively packaged with a lid slide glass by a thermal direct bonding. The presented developments are suitable for fast turn-around design cycle and inexpensive procedure, which provide rapid prototyping of MEMS devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 820: Symposia O/R – Nanoengineered Assemblies and Advanced Micro/Nanosystems , 2004 , O8.2
Copyright
Copyright © Materials Research Society 2004

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