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Preparation of a Reduced Layered Tungstic Acid HxW2O7 via Acid Treatment of Bi2W2O9 in the Presence of Sn2+ Ions

Published online by Cambridge University Press:  01 February 2011

Seiichi Tahara ,
Takakazu Minato ,
Nobuhiro Kumada ,
Shigenobu Hayashi  and
Yoshiyuki Sugahara
Seiichi Tahara
Affiliation:
[email protected], Waseda University, School of Science and Engneering, 3-4-1, Ohkubo, Shinjuku-ku, Tokyo, 169-8555, Japan, 81-3-5286-3204, 81-3-5286-3204
Takakazu Minato
Affiliation:
[email protected], Waseda University, Tokyo, 169-8555, Japan
Nobuhiro Kumada
Affiliation:
[email protected], University of Yamanashi, Yamanashi, 400-8511, Japan
Shigenobu Hayashi
Affiliation:
[email protected], National Institute of Advanced Industrial Science and Technology, Ibaraki, 305-8565, Japan
Yoshiyuki Sugahara
Affiliation:
[email protected], Waseda University, Tokyo, 169-8555, Japan
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Abstract

A reduced layered tungstic acid with a double-octahedral structure was prepared by acid treatment of an Aurivillius-type Bi2W2O9 in the presence of Sn2+ ions. While the color of the product formed by acid treatment with no Sn2+ ions present, H2W2O7, was yellow, a blue powder was obtained after the acid treatment in the presence of Sn2+ ions. No notable change in the morphology was observed after acid treatment. The X-ray diffraction pattern of the product acid-treated in the presence of Sn2+ ions was very similar to that of H2W2O7. Essentially all the Bi3+ ions were lost upon acid treatment, indicating the occurrence of selective leaching of bismuth oxide sheets in Bi2W2O9. A UV-visible absorption spectrum and XPS analysis demonstrated that the W6+ ions were partially reduced to W5+ ions, and the number of protons in the product was correspondingly 2.4 per [W2O7]. These results suggest the successful formation of a reduced layered tungstic acid, H2.4W2O7.

Keywords

layeredion-exchange materialintercalation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1056: Symposium HH – Nanophase and Nanocomposite Materials V , 2007 , 1056-HH11-20
Copyright
Copyright © Materials Research Society 2008

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References

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