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Power Delivery, Signaling and Cooling for 3D Integrated Systems

Published online by Cambridge University Press:  31 January 2011

Muhannad Bakir  and
Gang Huang
Muhannad Bakir
Affiliation:
[email protected], Georgia Tech, MiRC, 791 Atlantic Dr. NW, Atlanta, Georgia, 30332-0269, United States, 404-385-6276
Gang Huang
Affiliation:
[email protected], Intel, Austin, Texas, United States
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Abstract

Three-dimensional (3D) integration of ICs provides unique opportunities to improve bandwidth, latency, and power dissipation bottlenecks of interconnects (both on- and off-chip). However, while 3D IC integration improves signal interconnection, it also presents new challenges, especially in power delivery and cooling (“thermal interconnects”). The focus of this paper is on some of the key challenges and promising technologies to address power delivery, cooling, and signaling in a 3D stack of logic ICs.

Keywords

packagingmicroelectro-mechanical (MEMS)microelectronics
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1156: Symposium D – Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics–2009 , 2009 , 1156-D08-06-F06-06
Copyright
Copyright © Materials Research Society 2009

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