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Post-CMOS Integration of Nanomechanical Devices by Direct Ion Beam Irradiation of Silicon

Published online by Cambridge University Press:  03 August 2011

Francesc Pérez-Murano
Affiliation:
Institut de Microelectrònica de Barcelona (IMB-CNM, CSIC). Campus de la UAB, 08193 Bellaterra. Spain.
G. Rius
Affiliation:
Surface Science Laboratory. Toyota Technological Institute (TTI), 2-12-1 Hisakata, 468-8511 Nagoya. Japan
J. Llobet
Affiliation:
Institut de Microelectrònica de Barcelona (IMB-CNM, CSIC). Campus de la UAB, 08193 Bellaterra. Spain.
X. Borrisé
Affiliation:
Institut Català de Nanotecnologia (ICN). Campus de la UAB, 08193 Bellaterra. Spain
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Abstract

We present the development of CMOS compatible focused ion beam (FIB)-based method for the fabrication of nanomechanical devices. With only two step process, (i) patterning by direct exposure of silicon by the gallium beam and (ii) transfer of features to the structural layer by standard microfabrication silicon etching processes, operational devices are obtained. The ion beam modified silicon, acting as the etching mask, presents an outstanding robustness for both chemical and reactive ion etching process, enabling a simplified fabrication of nanomechanical devices with sub-micron resolution. As an example, single and double clamped silicon beams have been successfully produced. The compatibility check to guarantee the integrity of the electronic performance of CMOS circuits after the energetic beam irradiation is also investigated. Patterning based on direct ion beam exposure of silicon and etching presents advantages in comparison with more conventional lithography methods, such as electron beam lithography, since it is realized without the use of any resist media, which is especially challenging for the non-flat CMOS pre-fabricated substrates.

Type
Research Article
Copyright
Copyright © Materials Research Society 2011

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