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Polymer Spraying for Aerosol Jet Etching of Dielectrics for 156-mm Silicon Wafers

Published online by Cambridge University Press:  22 January 2014

John Rodriguez ,
Xi Wang ,
Jegadesan Subbiah ,
Cui Jie  and
Alison J. Lennon
John Rodriguez
Affiliation:
School of Photovoltaics and Renewable Energy, University of New South Wales, Kensington, NSW 2052, Australia
Xi Wang
Affiliation:
School of Photovoltaics and Renewable Energy, University of New South Wales, Kensington, NSW 2052, Australia
Jegadesan Subbiah
Affiliation:
Bio21 Institute, University of Melbourne, Parkville, VIC 3010, Australia
Cui Jie
Affiliation:
School of Photovoltaics and Renewable Energy, University of New South Wales, Kensington, NSW 2052, Australia
Alison J. Lennon
Affiliation:
School of Photovoltaics and Renewable Energy, University of New South Wales, Kensington, NSW 2052, Australia
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Abstract

The front surface of dielectric passivated silicon wafers were spray coated with polyacrylic acid (PAA) using an ultrasonic coating system. A simple model was proposed to correlate the degree of coverage with the number of spray passes. The sprayed PAA films enabled good etching of the dielectric, using a process referred to as aerosol jet etching (AJE), despite the fact that the PAA thickness was non-uniform over the substrate. The AJE tip-to-substrate distance and diameter of the tip were tuned to balance process throughput and the etched line width. Controlling the level of condensation in the aerosol jet printer (AJP) fluid path was critical for etching 156-mm pseudo square silicon wafers.

Keywords

solution depositionphotovoltaicspray deposition
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1630: Symposium O – Solution Processing of Inorganic and Hybrid Materials for Electronics and Photonics , 2014 , mrsf13-1630-o01-08
Copyright
Copyright © Materials Research Society 2014 

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References

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