Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-25T00:25:30.777Z Has data issue: false hasContentIssue false
  • English
  • Français

Organic Thin Film Transistors with Contacts Printed from Metal Nanoparticles

Published online by Cambridge University Press:  01 February 2011

Yiliang Wu ,
Yuning Li ,
Sandra Gardner  and
Beng S. Ong
Yiliang Wu
Affiliation:
New Materials Design and Synthesis Laboratory, Xerox Research Centre of Canada, Mississauga, Ontario, Canada L5K 2L1
Get access

Abstract

Metal nanoparticles were studied as solution printable precursors to highly conductive elements for electronic device applications. Dispersions of gold and silver nanoparticles stabilized respectively with butanethiol and hexadecylamine in organic solvents were used to prepare electrode features for organic thin film transistors (OTFTs) via stencil printing. The printed features, annealed at a relatively low temperature of 140-160°C, yielded metal electrodes with conductivities resembling those of vacuum-evaporated pure metals. The OTFTs with the source and drain electrodes of this nature exhibited field effect transistor performance identical to those of devices having vacuum-evaporated metal electrodes.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 871: Symposium I – Organic Thin-Film Electronics , 2005 , I2.3
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1a) Horowitz, G., Adv. Mater. 10, 365 (1998).Google Scholar
b) Katz, H., Bao, Z., Gilat, S., Acc. Chem. Res. 34, 359 (2001).Google Scholar
c) Dimitrakopoulos, C. D., Malenfant, P. R. L., Adv. Mater. 14, 99 (2002).Google Scholar
2a) Ong, B. S., Wu, Y., Liu, P., Gardner, S., J. Am. Chem. Soc. 126, 3378 (2004).Google Scholar
b) Ong, B. S., Wu, Y., Liu, P., Jiang, L., Murti, K., Synth. Met. 142, 49 (2004).Google Scholar
c) Wu, Y., Li, Y., Gardner, S., Ong, B. S., J. Am. Chem. Soc. 127, 614 (2005).Google Scholar
d) Wu, Y., Liu, P., Gardner, S., Ong, B.S., Chem. Mater. 17, 221 (2005).Google Scholar
e). Ong, B. S., Wu, Y., Liu, P., Gardner, S., Adv. Mater. 17, in press (2005).Google Scholar
3a) Meng, H., Bao, Z., Lovinger, A. J., Wang, B., Mujsce, A. M., J. Am. Chem. Soc. 123, 9214 (2001).Google Scholar
b) Katz, H. E., Lovinger, A. J., Johnson, J., Kloc, C., Siegrist, T., Li, W., Lin, Y.Y., Dodabalapur, A., Nature 404, 478 (2000).Google Scholar
c) Sirringhaus, H., Kawase, T., Friend, R. H., Shimoda, T., Inbasekaran, M., Wu, W., Woo, E. P., Science 290, 2123 (2000).Google Scholar
4a) Sirringhaus, H., Kawasem, T., Friend, R. H., Shimoda, T., Inbasekaran, M., Wu, W., Woo, E. P., Science 290, 2123 (2000).Google Scholar
b) Halik, M., Klauk, H., Zschieschang, U., Schmid, G., Radlik, W., Werner, W., Adv. Mater. 14, 1717 (2002).Google Scholar
5 Drury, C. J., Mutsaers, C. M. J., Hart, C. M., Maters, M., Leeuw, D. M. de, Appl. Phys. Lett. 73, 108 (1998).Google Scholar
6 Koezuka, H., Tsumura, A., Fuchigami, H., Kuramoto, K., Appl. Phys. Lett. 62, 1794 (1993).Google Scholar
7 Lefenfeld, M., Blanchet, G., Rogers, J. A., Adv. Mater. 15, 1188 (2003).Google Scholar
8 Brandon, E. J., West, W., Wesseling, E., Appl. Phys. Lett. 83, 3945 (2003).Google Scholar
9 Tate, J., Rogers, J. A., Jones, C. D. W., Vyas, B., Murphy, D. W., Li, W., Bao, Z., Slusher, R. E., Dodabalapur, A., Katz, H. E., Langmuir 16, 6054 (2000).Google Scholar
10a) Gray, C., Wang, J., Duthaler, G., Ritenour, A., Drzaic, P., Proceedings of SPIE 4466, 89 (2001).Google Scholar
b) Our results on 300 nm thin films of commercial silver inks gave conductivity around 2000 S/cm at 200°C.Google Scholar
11 Fuller, S. B., Wilhelm, E. J., Jacobson, J. M., J. Microelectromechanical Systems, 11, 54 (2002).Google Scholar
12 Buffat, P., Borel, J. P., Phys. Rev. A 13, 2287 (1976).Google Scholar
13 Wu, Y., Li, Y., Ong, B. S., Liu, P., Gardner, S., Chiang, B., Adv. Mater. 17, 184 (2005).Google Scholar
14 Li, Y., Wu, Y., Ong, B. S., J. Am. Chem. Soc. 127, 3266 (2005).Google Scholar
15 Brust, M., Fink, J., Bethell, D., Schiffrin, D. J., Kiely, C., J. Chem. Soc., Chem. Commun., 1655 (1995).Google Scholar