Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-24T14:09:27.955Z Has data issue: false hasContentIssue false
  • English
  • Français

Observation of Large, Anomalous Pyroelectric Response in AlN Thin Films

Published online by Cambridge University Press:  23 March 2011

Everett Crisman ,
Vladimir Vasilyev ,
Alvin Drehman  and
Richard Webster
Everett Crisman
Affiliation:
Dept. of Chemical Engineering, University of Rhode Island, Kingston, RI 02881, U.S.A
Vladimir Vasilyev
Affiliation:
Air Force Research Laboratory/RYHA, Hanscom AFB, MA 01731, U.S.A.
Alvin Drehman
Affiliation:
Air Force Research Laboratory/RYHA, Hanscom AFB, MA 01731, U.S.A.
Richard Webster
Affiliation:
Air Force Research Laboratory/RYHA, Hanscom AFB, MA 01731, U.S.A.
Get access

Abstract

We have observed a pyroelectric effect (PE) in reactively sputtered aluminum nitride (AlN) thin films that is typically a factor of twenty greater than commercial pyroelectric materials such as triglycine sulfate (TGS). This is most likely due to an extrinsic effect since the known crystalline structures of AlN are too symmetric to allow such high values for the PE response. Preliminary annealing studies support the assumption that residual strains remaining from the AlN thin film deposition are the most likely source of the anomalously high PE response. The results of these studies are presented along with some measurements that indicate a still higher PE response might be obtainable.

Keywords

thin filmsputteringstress/strain relationship
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1288: Symposium G – Novel Fabrication Methods for Electronic Devices , 2011 , mrsf10-1288-g06-26
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Bykhovski, D., Kaminski, V.V., Shur, M.S., Chen, Q.C., and Khan, M.A., Appl. Phys. Lett. 69, 3254 (1996).Google Scholar
2. Fuflygin, V., Salley, E., Osinsky, A., and Norris, P., Appl. Phys. Lett. 77, 3075 (2000).Google Scholar
3. Fraden, J., AIP Handbook of Modern Sensors, (AIP Press, New York, 1993) p. 96.Google Scholar
4. Crisman, E.E., Derov, J.S., Drehman, A.J., and Gregory, O.J., J. Electrochem. Soc., Solid-State Lett. 8(3) A141–L1 (2005).Google Scholar
5. NIST, Powder Diffraction Standards File No.25-1133. Google Scholar
6. The modeling program used for this project was E-Z Thermal available from GK Solutions, 1606 Slate Run Circle NE, Canton, OH 44721, (330) 499-3410. Google Scholar
7. Shur, M.S., Bykhovski, A. D. and Gaska, R., presented at the Materials Research Society fall meeting, November (1998).Google Scholar
8. Janssen, G. C. A. M., Abdalla, M. M., van Keulen, F. Pujada, B. R. and van Venrooy, B., Thin Solid Films 517(6) 2009 Google Scholar
9. Petersen, K.E., Silicon as a mechanical material, Proc. IEEE., Vol. 70, No. 5, 1982 Google Scholar
10. http://www.valleydesign.com/pyrex.html Google Scholar
11. Handbook of Electronic Materials, Vol 2, III-V Semiconductor Compounds, edited by Neuberger, M. (Plenum Press, New York, 1971) p.4.Google Scholar
12. Aita, C.R. and Gawlak, C.J., J. Vac. Sci. Technol., A 1(2), 403 (1983).Google Scholar