Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-24T15:59:55.817Z Has data issue: false hasContentIssue false

Modeling and Fabrication of Cladded Ge Quantum Dot Gate Silicon MOSFETs Exhibiting 3-State Behavior

Published online by Cambridge University Press:  01 February 2011

Faquir C. Jain
Affiliation:
[email protected], University of Connecticut, ECE, Storrs, Connecticut, United States
Mukesh Gogna
Affiliation:
[email protected], University of Connecticut, Storrs, United States
Fuad Alamoody
Affiliation:
[email protected], University of Connecticut, Storrs, United States
Supriya Karmakar
Affiliation:
[email protected], University of Connecticut, Storrs, United States
Ernesto Suarez
Affiliation:
[email protected], University of Connecticut, Storrs, United States
John Chandy
Affiliation:
[email protected], University of Connecticut, Storrs, United States
Evan Heller
Affiliation:
[email protected], RSoft Design Group, Ossinings, New York, United States
Get access

Abstract

This paper presents electrical transfer (Id-Vg) and output (Id-Vds) characteristics of a GeOx-cladded-Ge quantum dot (QD) gate Si MOSFET devices. In QD gate FETs, the manifestation of an intermediate state ‘i” makes it a 3-state device. The intermediate state originates due to compensation of increment in the gate voltage by a similar increase in the threshold voltage, which occurs via charge neutralization in the QD gate due to transfer of charge from the inversion layer to either first or second of the two QD layers.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]. Tiwari, S., Rana, F., Chan, K., Hanafi, H., Chan, W. and Buchanan, D., “Volatile and nonvolatile memories in silicon with nano-crystal storage,” IEDM, pp. 521525, Dec. 1995.Google Scholar
[2]. Jain, F. C., Heller, E., Karmakar, S., and Chandy, J., Device and Circuit Modeling using Novel 3-State Quantum Dot Gate FET, ISDRS Proc. December 11-14, 2007 (College Park, Md).Google Scholar
[3]. Hanyu, T., Kameyama, M., “A 200 MHz pipelined multiplier using 1.5 V-supply multiple valued MOS current-mode circuits with dual-rail source-coupled logic”, IEEE Journal of Solid-State Circuits vol. 30, no. 11, (1995).Google Scholar
[4]. Chandy, J. and Jain, F., “Multiple Valued Logic Using 3-StateQuantum Dot Gate FETs,” to appear in Proceedings of International Symposium on Multiple Valued Logic, May 2008.Google Scholar
[5]. Chuang, S., Holonyak, N., Appl. Phys. Lett., 2002; 80: 12701272.Google Scholar
[6]. Yang, E. S., Fundamentals of Semiconductor Devices, McGraw Hill, New York, NY, 1978.Google Scholar
[7]. Taur, Y. and Ning, T., Fundamentals of Modern VLSI Devices, Cambridge University Press, Cambridge, England, 1998.Google Scholar
[8]. Phely-Bobin, T., Chattopadhyay, D., Papadimitrakopoulos, F., “Characterization of Mechanically Attrited Si/SiOx Nanoparticles and Their Self-Assembled Composite FilmsChemistry of Materials, 2002, 14(3), 10301036.Google Scholar