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A microtensile set up for characterising the mechanical properties of films

Published online by Cambridge University Press:  01 February 2011

B. Cyziute ,
L. Augulis ,
J. Bonneville ,
P. Goudeau ,
B. Lamongie ,
S. Tamulevicius  and
C. Templier
B. Cyziute
Affiliation:
Fizikos katedra, Kauno Technologijos UniversitetasStudentu 50, 3028, Kaunas, Lithuania
L. Augulis
Affiliation:
Fizikos katedra, Kauno Technologijos UniversitetasStudentu 50, 3028, Kaunas, Lithuania
J. Bonneville
Affiliation:
Laboratoire de Métallurgie Physique, Université de Poitiers, UMR-CNRS 6630, BP 30179, 86962 Futuroscope, France
P. Goudeau
Affiliation:
Laboratoire de Métallurgie Physique, Université de Poitiers, UMR-CNRS 6630, BP 30179, 86962 Futuroscope, France
B. Lamongie
Affiliation:
Laboratoire de Métallurgie Physique, Université de Poitiers, UMR-CNRS 6630, BP 30179, 86962 Futuroscope, France
S. Tamulevicius
Affiliation:
Fizikos katedra, Kauno Technologijos UniversitetasStudentu 50, 3028, Kaunas, Lithuania
C. Templier
Affiliation:
Laboratoire de Métallurgie Physique, Université de Poitiers, UMR-CNRS 6630, BP 30179, 86962 Futuroscope, France
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Abstract

A computer control deformation set-up has been specifically developed for measuring the elastic and plastic properties of thin films. It combines a piezo-actuated microtensile-testing device, based on an original tripod design, with an optical image acquiring and analysis system for measuring specimen strains. The paper will be partly devoted to describe the experimental deformation set up and its performance through mechanical tests of polyimide and aluminum samples. The Young's moduli, which are deduced from the stress-strain curves, are in good agreement with reported bulk average values. The results confirmed the ability of the equipment for the measurements of very small load and displacement levels, which are a prerequisite for such type of investigations.

Keywords

Thin filmtensile testmechanical propertiesload relaxation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 875: Symposium O – Thin Films - Stresses and Mechanical Properties XI , 2005 , O4.8
Copyright
Copyright © Materials Research Society 2005

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