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Micromolding of Pb and Zn with Surface Engineered LiGA Mold Inserts

Published online by Cambridge University Press:  11 February 2011

D. M. Cao
Affiliation:
Mechanical Engineering Department, Louisiana State University, Baton Rouge, LA, 70803, U.S.A.
D. J. Guidry
Affiliation:
Mezzo Systems Inc., LBTC, South Stadium Drive, Baton Rouge, LA, 70803, U.S.A.
W. J. Meng
Affiliation:
Mechanical Engineering Department, Louisiana State University, Baton Rouge, LA, 70803, U.S.A.
K. W. Kelly
Affiliation:
Mechanical Engineering Department, Louisiana State University, Baton Rouge, LA, 70803, U.S.A. Mezzo Systems Inc., LBTC, South Stadium Drive, Baton Rouge, LA, 70803, U.S.A.
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Abstract

Molding of Pb and Zn metal plates with LiGA (Lithographie, Galvanoformung, Abformung) fabricated Ni micro-scale mold inserts was carried out with as fabricated Ni inserts and Ni inserts conformally coated with Ti-containing hydrocarbon (Ti-C:H) coatings. The molding performance was characterized using scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS), in terms of the generated features on the metal plates as well as the inserts condition after molding. The present results demonstrate that, in cases where significant metal/insert chemical interactions exist, surface modification of the mold insert is necessary to obtain satisfactory performance. Furthermore, conformal deposition of suitable engineered ceramic coatings onto Ni micro-scale mold inserts is effective for high temperature micromolding of reactive metals.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCES

1. Becker, E.W., Ehrfeld, W., Munchmeyer, D., Betz, H., Heuberger, A., Pongratz, S., Glashauser, W., Michel, H.J., Siemens, V.R., Naturwissenschaften 69, 520 (1982).Google Scholar
2. Weber, L., Ehrfeld, W., Freimuth, H., Lacher, M., Lehr, H., Pech, B., SPIE Proceeding, Micromachining and Microfabrication Process Technology II 156, Austin, Texas, U.S.A, (1996).Google Scholar
3. Gopal, S., Lakare, A., Shivpuri, R., Die Casting Engineering, May/June, 70 (2000).Google Scholar
4. Cao, D.M., Wang, T., Feng, B., Meng, W.J., Kelly, K.W., Thin Solid Films 398/399, 553 (2001).Google Scholar
5. Meng, W.J., Tittsworth, R.C., Jiang, J.C., Feng, B., Cao, D.M., Winkler, K., Palshin, V., J. Appl. Phys. 88, 2415 (2000).Google Scholar
6. Cao, D.M., Feng, B., Meng, W.J., Rehn, L.E., Baldo, P.M., Khonsari, M.M., Appl. Phys. Lett. 79, 329 (2001).Google Scholar
7. Feng, B., Cao, D.M., Meng, W.J., Rehn, L.E., Baldo, P.M., Doll, G.L., Thin Solid Films 398/399, 210 (2001).Google Scholar
8. Meng, W.J., Curtis, T.J., J. Electronic Materials 26, 1297 (1997).Google Scholar
9. Meng, W.J., Curtis, T.J., Rehn, L.E., Baldo, P.M., Surf. Coat. Technol. 120/121, 206 (1999).Google Scholar
10. Cao, D.M., Guidry, D., Meng, W. J., Kelly, K.W., submitted to Microsystems Technol., (2002).Google Scholar
11. Miedema, A.R., Philips Tech. Rev. 36(8), 217 (1976).Google Scholar
12. Binary Alloy Phase Diagrams, Massalski, T.B. (ed.), 2, 1738, 1772, American Society of Metals, Metals Park, Ohio, (1986).Google Scholar