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Micromachined Lateral Force Sensors for Characterization of Microscale Surface Forces During Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

Douglas Gauthier
Affiliation:
[email protected], Tufts University, Medford, MA, 02155, United States
Andrew Mueller
Affiliation:
[email protected], Tufts University, Medford, MA, 02155, United States
Robert David White
Affiliation:
[email protected], Tufts University, Mechanical Engineering, 200 College Ave, Medford, MA, 02155, United States
Vincent Manno
Affiliation:
[email protected], Tufts University, Medford, MA, 02155, United States
Chris Rogers
Affiliation:
[email protected], Tufts University, Medford, MA, 02155, United States
Donald Hooper
Affiliation:
[email protected], Intel Corporation, Santa Clara, CA, 95052, United States
Sriram Anjur
Affiliation:
[email protected], Cabot Microelectronics, Aurora, IL, 60504, United States
Mansour Moinpour
Affiliation:
[email protected], Intel Corporation, Santa Clara, CA, 95052, United States
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Abstract

Micromachined structures with diameters ranging from 50 — 100 μm have been applied to the measurement of the microscale shearing forces present at the wafer-pad interface during chemical mechanical polishing (CMP). The structures are 80 μm high poly-dimethyl-siloxane posts with bending stiffnesses ranging from 1.6 to 14 μN/μm. The structures were polished using a stiff, ungrooved pad and 3 wt% fumed silica slurry at relative velocities of approximately 0.5 m/s and downforces of approximately 1 psi. Observed lateral forces on the structures were on the order of 5–500 μN, and highly variable in time.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

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References

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