Hostname: page-component-78c5997874-v9fdk Total loading time: 0 Render date: 2024-11-02T23:35:25.247Z Has data issue: false hasContentIssue false

The Mechanical Properties of Cu/TiB2 Multilayer Structures

Published online by Cambridge University Press:  16 February 2011

Kevin M. Hubbard
Affiliation:
Materials Science and Technology Division Los Alamos National Laboratory, Los Alamos, NM 87545
S. N. Basu
Affiliation:
Materials Science and Technology Division Los Alamos National Laboratory, Los Alamos, NM 87545
J-P. Hirvonen
Affiliation:
Materials Science and Technology Division Los Alamos National Laboratory, Los Alamos, NM 87545
T. R. Jervis
Affiliation:
Materials Science and Technology Division Los Alamos National Laboratory, Los Alamos, NM 87545
M. Nastasi
Affiliation:
Materials Science and Technology Division Los Alamos National Laboratory, Los Alamos, NM 87545
Get access

Abstract

We have investigated the hardness and tribological properties of Cu/TiB2 multilayer structures deposited on substrates of tempered martensitic steel. Films of Cu and TiB2 were also deposited as hardness standards. The wear properties of the films were found to be poor, because of lack of adhesion. However, the films do appear to have good fracture toughness. The hardness of the multilayer was 18% greater than that predicted by the law of mixtures applied to the reference standards and, when corrected for variations in substrate hardness, very nearly equal to that of the TiB2 film. Irradiation by 400 keY Ne-ions to doses of 1.0, 6.0, and 12×1015 ion/cm2 results in a slight hardening of the multilayer. The structure was found to have excellent stability against radiation damage.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Koehler, J.S., Phys. Rev. B 2, 547 (1970).Google Scholar
[2] Lehoczky, S.L., Phys. Rev. Lett. 41, 1814 (1978).Google Scholar
[3] Lehoczky, S.L., J. Appl. Phys. 49, 5479 (1978).Google Scholar
[4] Movchan, B.A., Demchishin, A.V., Badilenko, G.F., Bunshah, R.F., Sans, C., Deshpandey, C., and Doerr, H.J., Thin Solid Films 97, 215 (1982), and ref. therein for other work by this group.Google Scholar
[5] Springer, R. W and Catlett, D.S., Thin Solid Films 54, 197 (1978).Google Scholar
[6] Helmersson, U., Todorova, S., Barnett, S.A., Sundgren, J.-E., Markert, L.C., and Greene, J.E., J. Appl. Phys. 62, 481 (1987).Google Scholar
[7] Basu, S.N., Hubbard, K.M., Hirvonen, J-P., Mitchell, T.E., and Nastasi, M., Symposium on Thin Film Structures and Phase Stability, MRS Spring Meeting, 1990.Google Scholar
[8] TRIM89, see Zeigler, J.F., Biersack, J.P., and Littmark, U., The Stopping and Range of Ions in Solids, (Pergamon Press, New York, 1985).Google Scholar
[9] Oliver, W.C., Hutchings, R., and Pethica, J.B., ASTM Spec. Tech. Pub. 889, 90 (1986).Google Scholar
[10] Motojima, S., Yamada, M., and Sugiyama, K., J. Nucl. Mat. 105, 335 (1982).Google Scholar
[11] For instance: Morrison, D.J., Jones, J.W., Was, G.S., Mashayekhi, A., and Hoffman, D.W., Mat. Res. Soc. Symp. Proc. vol.130, 53 (1989).Google Scholar
[12] Oliver, W.C., McHargue, C.J., and Zinkle, S.J., Thin Solid Films 153, 185 (1987).Google Scholar
[13] Doerner, M.F. and Nix, W.D., J. Mat. Res. 1, 601 (1986).Google Scholar