Hostname: page-component-745bb68f8f-cphqk Total loading time: 0 Render date: 2025-01-12T09:52:12.630Z Has data issue: false hasContentIssue false
  • English
  • Français

Mechanical Properties of Al-Cu Films with Various Heat Treatments

Published online by Cambridge University Press:  10 February 2011

Young-Chang Joo ,
Peter Müllner ,
Shefford P. Baker  and
Eduard Arzt
Young-Chang Joo
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, Germany
Peter Müllner
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, Germany
Shefford P. Baker
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, Germany
Eduard Arzt
Affiliation:
Max-Planck-Institut für Metallforschung, Seestr. 92, D-70174 Stuttgart, Germany
Get access

Abstract

Precipitation and solid solution hardening have been studied in Al-Cu thin films with Cu content ranging from 0 to 2 wt%. We have changed the precipitate and dislocation structures of films having different Cu concentrations by varying the heat treatments prior to mechanical testing. Pure Al films showed the same values of tensile and compressive yield stresses at a given temperature during stress-temperature cycling. Al-Cu alloy films, however, showed larger stresses in tension than in compression. The compressive flow stress during heating could be changed by a factor of five by the initial heat treatment, but the differences disappeared above 250°C. Upon cooling from 480°C, solution hardening as well as precipitation hardening was observed in the Al-Cu films. Solution hardening is independent of Cu concentration, but for precipitation hardening, both the magnitude and the temperature range in which the mechanism is effective are sensitive to the Cu concentration. The microstructure was observed using transmission electron microscopy. The mechanical behavior is consistent with interactions between dislocations and precipitates which arise due to constraints on the film by the substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 473: Symposium J – Materials Reliability in Microelectronics VII , 1997 , 409
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. d'Heurle, F. M., Ainslie, N. G., Gangulee, A., and Shine, M. C., J. Vac. Sci. Technol. 9, 289 (1972).Google Scholar
2. Silcock, J. M., Heal, T. J., and Hardy, H. K., J. Inst. Metals, 82, 239 (1953-1954).Google Scholar
3. Frear, D.R., Sanchez, J.E. Jr, Romig, A.D., and Morris, J.W. Jr, Metall. Trans. A21, 2449 (1990).Google Scholar
4. Kim, C. and Morris, J.W. Jr, J. Appl. Phys. 72, 1837 (1992).Google Scholar
5. Flinn, P.A., Gardner, D.S., and Nix, W.D., IEEE Trans. ED. 34, 689 (1987).Google Scholar
6. Stoney, G.G., Proc. R. Soc. A82, 172 (1909).Google Scholar
7. Doerner, M.F., Gardner, D.S., and Nix, W.D., J. Mater. Res. 1, 845 (1987).Google Scholar
8. Volkert, C.A., Alofs, C.F., and Liefting, J.R., J. Mater. Res. 9, 1147 (1994).Google Scholar
9. Hansen, M., Constitution of Binary Alloys, McGraw-Hill, New York, NY, 1965.Google Scholar