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Manufacturability Study for Etching High-Density BST/Pt Capacitors

Published online by Cambridge University Press:  21 March 2011

Jay Hwang
Jay Hwang*
Affiliation:
Applied Materials Inc., 974 E. Arques Ave., M/S 81330 Sunnyvale, CA 94086, U.S.A
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Abstract

Profile control, process repeatability and productivity concerns in etching Pt electrodes are reviewed specifically for application in fabricating high-density BST/Pt capacitors. The approach of using a high temperature cathode in a high-density reactive plasma chamber has produced a repeatable >85° Pt profile, stable etch rate and low particle results over a 500-wafer marathon test. A “corrosion-like” BST defect can be prevented by adding a post etch treatment to remove any corrosive residue from the wafer surface. A feasible manufacturing solution for etching BST/Pt capacitors for future high-density DRAM application is demonstrated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 655 , 2000 , CC6.6.1
Copyright
Copyright © Materials Research Society 2001

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