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Laser Micromachining of Metallic Mold Inserts for Replication Techniques

Published online by Cambridge University Press:  10 February 2011

W. Pfleging ,
A. Meier ,
T. Hanemann ,
H. Gruhn  and
K.-H. Zum Gahr
W. Pfleging
Affiliation:
Forschungszentrum Karlsruhe GmbH, Institute for Materials Research, P.O. Box 3640, 76021 Karlsruhe, Germany
A. Meier
Affiliation:
Forschungszentrum Karlsruhe GmbH, Institute for Materials Research, P.O. Box 3640, 76021 Karlsruhe, Germany
T. Hanemann
Affiliation:
Forschungszentrum Karlsruhe GmbH, Institute for Materials Research, P.O. Box 3640, 76021 Karlsruhe, Germany
H. Gruhn
Affiliation:
Forschungszentrum Karlsruhe GmbH, Institute for Materials Research, P.O. Box 3640, 76021 Karlsruhe, Germany
K.-H. Zum Gahr
Affiliation:
Forschungszentrum Karlsruhe GmbH, Institute for Materials Research, P.O. Box 3640, 76021 Karlsruhe, Germany
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Abstract

The laser microcaving (LMC) of steel is performed with cw Nd:YAG laser radiation. LMC enables a “clean” patterning process with only a small amount of debris and melt. During LMC the formation of a Ni-enriched interface layer and an oxide surface layer may be observed. The formation of these reaction layers as well as the etch rate and the surface quality strongly depend on the chemical composition of the steel and the process parameters. Surface qualities with an roughness of about Ra(center line average)=300 nm can be realised. The ablation rates are in the range of 106 µm3/s. With excimer laser radiation a further improvement of surface topographies can be achieved via laser planarisation. Mold inserts are manufactured by LMC, and microstructures composed of PMMA are successfully demolded by using the Ultraviolet light induced Reaction Injection Molding (UV-RIM) or Photomolding technique. CE(Capillary Electrophoresis)-Chips made of PMMA are successfully demolded, and the functionality of the CE-Chips is demonstrated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 617: Symposium J – Laser-Solid Interactionsfor Materials Processing , 2000 , J5.5
Copyright
Copyright © Materials Research Society 2000

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