Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-11-28T11:27:36.276Z Has data issue: false hasContentIssue false

Intermetallic Formation in PZT for MEMS Structures

Published online by Cambridge University Press:  09 August 2012

Kanu priya Sharma
Affiliation:
Dep. of Electrical and Computer Engineering, NC State University, Raleigh, NC-27695, U.S.A
Thomas Oseroff
Affiliation:
Dep. of Electrical and Computer Engineering, NC State University, Raleigh, NC-27695, U.S.A
Leda Lunardi
Affiliation:
Dep. of Electrical and Computer Engineering, NC State University, Raleigh, NC-27695, U.S.A
Get access

Abstract

Crack free lead zirconate titanate (PZT) films for piezoelectric based MEMS devices have been prepared by a multiple coating sol gel process on platinized silicon (100) substrates. Rapid thermal annealing and Conventional furnace annealing were used for densification and crystallization of the amorphous PZT films. Scanning electron microscopy (SEM), Transmission electron microscopy (TEM) and Atomic force microscopy (AFM) were used to observe surface film morphology and grain growth. The phase content of the films was analyzed using X-ray diffraction. The role of intermetallics formed during the heat treatment in the growth of different orientations has also been observed. Film aging critical for device performance has been observed and methods to revert aging effects have been examined and discussed.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Sakashita, Y., Ono, T., Segawa, H., Tominaga, K. and Okada, M., J. Appl. Phys. 69, 8352 (1991).Google Scholar
[2] Jacobsen, H., Prume, K., Wagner, B., Ortner, K. and Jung, T., J. Electroceramics , 25,198 (2010).Google Scholar
[3] Husmann, A., Wesner, D.A., Schmidt, J., Klotzbücher, T., Mergens, M., and Kreutz, E.W., Surface and Coatings Technology, 97,420, (1997).Google Scholar
[4] Izyumskaya, N., Avrutin, A. V., Gu, X., Xiao, B., Chevtchenko, S., Yoon, J.-G., and Morkoç, H., Appl. Phys. Lett., 91, 182906 (2007).Google Scholar
[5] Roy, R., Science 238 (4834) 1664(1987).Google Scholar
[6] Assink, R. A., and Schwartz, R. W., Chem. Mater. 5, 5171993,(1993).Google Scholar
[7] Kozukaand, H., Takenaka, S., J. Am. Ceram. Soc. 85, 2696, (2002).Google Scholar
[8] Huang, Z., Zhang, Q., and Whatmore, R. W., J. Appl. Phys. 85, 7355, and 86, 1662 (1999)Google Scholar
[9] Brooks, K. G., Reaney, I M., Klissurska, R., Huang, Y., Bursill, L., and Setter, N., J. Mater. Res. 9 (10), 25402553 (1994);Google Scholar
[10] Kwok, C. K. and Desu, S B., J. Mater. Res. 8(2), 339344 (1993).Google Scholar