Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-28T11:34:15.556Z Has data issue: false hasContentIssue false

The Integration of the Ferromagnetic Inductors into the Standard CMOS Chip

Published online by Cambridge University Press:  09 August 2012

Oleg Nizhnik
Affiliation:
Maenaka Human-Sensing Fusion Project, Japan Science and Technology Agency, Open Labs., Bldg, University Of Hyogo 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Olinver M. Vinluan
Affiliation:
Maenaka Human-Sensing Fusion Project, Japan Science and Technology Agency, Open Labs., Bldg, University Of Hyogo 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Kohei Higuchi
Affiliation:
Maenaka Human-Sensing Fusion Project, Japan Science and Technology Agency, Open Labs., Bldg, University Of Hyogo 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Koji Sonoda
Affiliation:
Maenaka Human-Sensing Fusion Project, Japan Science and Technology Agency, Open Labs., Bldg, University Of Hyogo 2167 Shosha, Himeji, Hyogo, 671-2280, Japan Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Masatoshi Ishii
Affiliation:
Maenaka Human-Sensing Fusion Project, Japan Science and Technology Agency, Open Labs., Bldg, University Of Hyogo 2167 Shosha, Himeji, Hyogo, 671-2280, Japan Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Kazusuke Maenaka
Affiliation:
Maenaka Human-Sensing Fusion Project, Japan Science and Technology Agency, Open Labs., Bldg, University Of Hyogo 2167 Shosha, Himeji, Hyogo, 671-2280, Japan Graduate School of Engineering, University of Hyogo, 2167 Shosha, Himeji, Hyogo, 671-2280, Japan
Get access

Abstract

An inductor in standard CMOS process having an inductance of 52 nH and a quality factor of 1.5 at frequency equal to 80 Mhz was fabricated. The polymer passivation layer of the standard CMOS inductor was etched out. The silicon substrate under the inductor, having a thickness of 280 μm was also etched out by deep reactive ion etching (DRIE). Ferrite material ZnFe2O4 and amorphous material Fe4.7Co70.3Si15B10 was then sputtered on top of the inductor sequentially. The same sputtering procedure was also performed into the bottom of the inductor. The result is an inductor that is sandwiched by multiple ferromagnetic layers. The inductance of the new ferromagnetic inductor has increased by 15% from 52 nH to 60 nH. The quality factor has also increased by 20% from 1.5 to 1.8.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Ni, J., Hong, Z., Liu, B. Y.Improved On-chip Components for Integrated DC-DC Converters in 0.13μm CMOSESSCIRC, 2009 Google Scholar
2. Sizikov, Gregory et al. . “Frequency Dependent Efficiency Model of On-Chip DC-DC Buck Converters”, 2010 IEEE 26-th Convention of Electrical and Electronics Engineers in Israel.Google Scholar
3. Schrohm, G. et al. . “Optimal Design of Monolithic Integrated DC-DC convertersIntegrated Circuit Design and Technology (ICICDT) 2006 Google Scholar
4. Gardner, et al. , “Review of On-chip Inductor Structures with Magnetic FilmsIEEE TRANSACTIONS ON MAGNETICS, VOL. 45, NO. 10, OCTOBER 2009.Google Scholar
5. Liu, Y., Sellmyer, D.J., Daisuke Shindo in Handbook of Advanced Magnetic Material, Volume 1: Advanced Magnetic Materials: Nanostructural Effects, pp 192 Google Scholar