Hostname: page-component-78c5997874-dh8gc Total loading time: 0 Render date: 2024-11-02T22:47:42.131Z Has data issue: false hasContentIssue false
  • English
  • Français

Influence of Underlayer and Encapsulation Process on Texture in Polycrystalline Silver Thin Films

Published online by Cambridge University Press:  10 February 2011

Yuxiao Zeng ,
Y. L. Zou ,
T. L. Alford ,
F. DENG ,
S. S Lau ,
T. Laursen  and
B. Manfred Ullrich
Yuxiao Zeng
Affiliation:
Department of Chemical, Bio and Materials Engineering, Center for Low Power Electronics
Y. L. Zou
Affiliation:
Department of Chemical, Bio and Materials Engineering, Center for Low Power Electronics
T. L. Alford
Affiliation:
Department of Chemical, Bio and Materials Engineering, Center for Low Power Electronics
F. DENG
Affiliation:
Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA 92093
S. S Lau
Affiliation:
Department of Electrical and Computer Engineering, University of California at San Diego, La Jolla, CA 92093
T. Laursen
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
B. Manfred Ullrich
Affiliation:
Center for Solid State Science, Arizona State University, Tempe, AZ 85287
Get access

Abstract

The texture in polycrystalline Ag thin films prepared by e-beam evaporation has been characterized by an x-ray diffraction technique as a function of underlayers and encapsulation temperatures. The Ag films deposited on Ti layers showed a strong <111> fiber texture with a fiber axis parallel to the film normal, whereas an almost random orientation was observed in the Ag films on Cr layers. This underlayer dependence of texture is associated with the lattice match between Ag and underlayer metal. In addition to <111> texture, the Ag films on Ti also exhibited a <511> texture component, which is the result of twinning of <111> -oriented grains. After the encapsulation process, the <111> texture in the Ag films on Ti was significantly improved, as evidenced by an increased (111) diffraction intensity and a slightly narrower space distribution of the texture along the fiber axis. The highly textured Ag films are expected to exhibit an improved electromigration resistance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 472: Symposium I – Polycrystalline Thin Films - Structure, Texture, Properties..III , 1997 , 203
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Alford, T. L., Adams, Daniel, Laursen, T. and Manfred Ullrich, B., Appl. phys. Lett., 68 (1996)3251.Google Scholar
2. Zou, Y. L., Alford, T. L., Adams, D., Laursen, T., Tu, K. -N. and Lau, S. S., Mat. Res. Soc. Symp. Proc, 427 (1996) 355.Google Scholar
3. Laursen, T., Adams, D., Alford, T. L., Tu, K. -N., Deng, F., Morton, R. and Lau, S. S., Thin Solid films, 490(1996)411.Google Scholar
4. Murarka, S. P., Gutmann, R. J., Kaloyeros, A. E. and Lanford, W. A., Thin Solid films, 236 (1993)257.Google Scholar
5. Sharma, S. K. and Spitz, J., Thin Solid films, 65 (1980) 339.Google Scholar
6. McBrayer, J. D., Swanson, R. M., and Simon, T. W., J. Electrochem. Soc. 133 (1986) 1243.Google Scholar
7. Graedel, T. E., J. Electrochem. Soc, 139 (1992) 1963.Google Scholar
8. Vaidya, S. and Sinha, A. K., Thin Solid films, 75 (1981) 252.Google Scholar
9. Knorr, D. B., Mat. Res. Soc Symp. Proc, 309 (1993) 75.Google Scholar
10. Tracy, D. P., Knorr, D. B. and Rodbell, K. P., J. Appl. Phys., 76 (1994) 2671.Google Scholar
11. Attardo, J. and Rosenberg, R., J. Appl. Phys., 41 (1970) 2381.Google Scholar
12. knorr, D. B. and Rodbell, K. P., J. Appl. Phys., 79 (1996) 2409.Google Scholar
13. Zeng, Yuxiao, Zou, Y. L., and Alford, T. L., submitted to Thin Solid films.Google Scholar
14. Tsukada, M., Ohfuji, S., J. Vac. Sci. Technol., B11 (1993) 326.Google Scholar
15. Shibata, H., Murota, M. and Hashimoto, K., Jpn. J. Appl. Phys., 32, Pt. 1 (1993) 4479.Google Scholar
16. Vinci, R. P. and Bravman, J. C., Mat. Res. Soc Symp. Proc, 309 (1993) 269.Google Scholar
17. Rodwell, K. P., Knorr, D. B., and Tracy, D. P., Mat. Res. Soc. Symp. Proc, 265 (1992) 107.Google Scholar
18. Tracy, D. P. and Knorr, D. B., J. Electron. Mater., 22 (1993) 611.Google Scholar
19. Sundquist, B. E., Acta Metall., 12 (1964) 67.Google Scholar