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The Influence of Temperature and Concentration on CopperDeposition Kinetics in Supercritical Carbon Dioxide

Published online by Cambridge University Press:  17 March 2011

Yinfeng Zong  and
James J. Watkins
Yinfeng Zong
Affiliation:
Department of Chemical Engineering, University of Massachusetts Amherst, Amherst, MA 01003
James J. Watkins
Affiliation:
Department of Chemical Engineering, University of Massachusetts Amherst, Amherst, MA 01003
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Abstract

The kinetics of copper deposition by the hydrogen-assisted reduction ofbis(2,2,7- trimethyloctane-3,5-dionato)copper in supercritical carbondioxide was studied as a function of temperature and precursorconcentration. The growth rate was found to be as high as 31.5 nm/min.Experiments between 220 °C and 270 °C indicated an apparent activationenergy of 51.9 kJ/mol. The deposition kinetics were zero order with respectto precursor at 250 °C and 134 bar and precursor concentrations between0.016 and 0.38 wt.% in CO2. Zero order kinetics over this largeconcentration interval likely contributes to the exceptional step coverageobtained from Cu depositions from supercritical fluids.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F8.6
Copyright
Copyright © Materials Research Society 2004

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