Hostname: page-component-78c5997874-mlc7c Total loading time: 0 Render date: 2024-11-16T03:28:54.607Z Has data issue: false hasContentIssue false
  • English
  • Français

Influence of Gas Atmosphere on the Plasticity of Metal Thin Films

Published online by Cambridge University Press:  01 February 2011

T. Wübben ,
G. Dehm  and
E. Arzt
T. Wübben
Affiliation:
Max-Planck Institute for Metals Research, Stuttgart, Germany
G. Dehm
Affiliation:
now at Erich Schmid Institut für Materialwissenschaft, Österreichische Akademie der Wissenschaften, and Department für Materialphysik, Montanuniversität Leoben, Leoben, Austria
E. Arzt
Affiliation:
Max-Planck Institute for Metals Research, Stuttgart, Germany Institut für Metallkunde, University of Stuttgart, Stuttgart, Germany
Get access

Abstract

Stresses in thin films are routinely measured by the so-called substrate curvature technique. These experiments are usually carried out in air or under a protective gas atmosphere. In this contribution we describe a new set-up capable of performing substrate curvature measurements under ultra-high vacuum conditions. The advantages are the absence of possible artifacts due to gas/film interactions, better control of gas composition, and the possibility to measure chemical effects on mechanical properties in a controlled way. We present first results that indicate an unexpected sensitivity even of polycrystalline Cu films to the gas environment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 875: Symposium O – Thin Films - Stresses and Mechanical Properties XI , 2005 , O6.5
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kobrinsky, M. J. and Thompson, C. V., Applied Physics Letters 73, 2429 (1998).Google Scholar
2. Weiss, D., Gao, H., and Arzt, E., Acta Materialia 49, 2395 (2001).Google Scholar
3. Keller, R.-M., Baker, S. P., and Arzt, E., Acta Materialia 47, 415 (1999).Google Scholar
4. Gao, H., Zhang, L., Nix, W. D., Thompson, C. V., and Arzt, E., Acta Materialia 47, 2865 (1999).Google Scholar
5. Sakong, S. and Gross, A., Surface Science 525, 107 (2003).Google Scholar
6. Nix, W. D., Metallurgical Transactions A 20A, 1989 (1989).Google Scholar
7. Flinn, P. A., in “Thin Films: Stresses and Mechanical Properties” (Bravman, J. C., Nix, W. D., Barnett, D. M., and Smith, D. A., eds.), Vol. 130, p. 41–51. Materials Research Society, Pittsburgh, PA, 1989.Google Scholar
8. Balk, T. J., Dehm, G., and Arzt, E., Acta Materialia 51, 4471 (2003).Google Scholar
9. Dehm, G., Balk, T. J., Edongue, H., and Arzt, E., Microelectronic Engineering 70, 412 (2003).Google Scholar
10. Ammon, C., Bayer, A., Held, G., Richter, B., Schmidt, T., and Steinruck, H.-P., Surface Science 507-510, 845 (2002).Google Scholar
11. Francis, S. M., Leibsle, F. M., Haq, S., Xiang, N., Bowker, M., Surface Science 315, 284 (1994).Google Scholar
12. Ryberg, R., The Journal of Chemical Physics 82, 567 (1985).Google Scholar