Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-24T13:56:20.838Z Has data issue: false hasContentIssue false
  • English
  • Français

Influence of Addition of Alumina Nanoparticles on Thermoelectric Properties of Higher Manganese Silicide

Published online by Cambridge University Press:  18 December 2012

Takashi Itoh  and
Naoki Ono
Takashi Itoh
Affiliation:
Department of Materials, Physics and Energy Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, 464-8603, Japan
Naoki Ono
Affiliation:
Department of Materials, Physics and Energy Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, 464-8603, Japan
Get access

Abstract

Higher manganese silicide (HMS) is a low-cost and eco-friendly thermoelectric material available for recovering waste heat of 500 to 900 K. In this research, we tried to uniformly disperse the alumina nanoparticles (ANPs) in the HMS matrix to reduce the thermal conductivity and to improve the thermoelectric performance. Influence of addition of ANPs on the thermoelectric properties was investigated. It was confirmed that ANPs were uniformly dispersed in the HMS grain boundary. The lattice thermal conductivity was reduced by adding ANPs. As a result, the maximum thermoelectric performance of ZT=0.58 was achieved at about 800 K by adding 1 vol% of ANPs. The performance of ANPs-added HMS was improved about 25 %.

Keywords

thermoelectricitypowder metallurgyadditives
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1490: Symposium B – Thermoelectric Materials Research and Device Development for Power Conversion and Refrigeration , 2013 , pp. 127 - 132
Copyright
Copyright © Materials Research Society 2012 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

De Riddera, R. and Amelinckx, S., Mat. Res. Bull. 6, 1223 (1971).CrossRefGoogle Scholar
Umemoto, M., Liu, Z. G., Omatsuzawa, R., Tsuchiya, K., Mater. Sci. Forum 343-346, 918 (2000).CrossRefGoogle Scholar
Itoh, T., Yamada, M., J. Electronic Materials 38, 925 (2009).CrossRefGoogle Scholar
Yoshikura, M., Itoh, T., J. Jpn. Soc. Powder Powder Metallurgy 57, 242 (2010). (in Japanese) CrossRefGoogle Scholar
Ono, N., Itoh, T., Proc. International Symposium on Materials Science Innovation for Sustainable Society, Vol. 2 pp. 11–12, (2011).Google Scholar
Itoh, T., Ishikawa, K., Okada, A., J. Mater. Res. 22, 249 (2007).CrossRefGoogle Scholar
Itoh, T., Tachikawa, M., Mater. Res. Soc. Symp. Proc. Vol. 1314, Cambridge University Press, pp. Online mrsf10-1314-ll08-18 (6pp) (2011).Google Scholar
Itoh, T., Matsuhara, M., Mater. Trans. 53, 1801 (2012).CrossRefGoogle Scholar
Zhou, X., Wang, G., Zhang, L., Chi, H., Su, X., Sakamoto, J., Uher, C., J. Mater. Chem. 22, 2958 (2012).CrossRefGoogle Scholar
Cederkrantz, D., Farahi, N., Borup, K., Iversen, B., Nygren, M., Palmqvist, A., J. Appl. Phys. 111, 023701 (2012).CrossRefGoogle Scholar
Zhang, Q., Wang, H., Zhang, Q., Liu, W., Yu, B., Wang, H., Wang, D., Ni, G., Chen, G., Ren, Z., Nano Lett. 12, 2324 (2012).CrossRefGoogle Scholar