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High-Speed, High-Sensitivity Polyimide Humidity Sensors Based on MEMS Microhotplates

Published online by Cambridge University Press:  01 February 2011

Jea Sung Kim ,
Tea Jin Kim ,
Moon Sik Kang ,
Kum Pyo Yoo  and
Nam Ki Min
Jea Sung Kim
Affiliation:
Control and Instrumentation Engineering, Korea University, Seoul, 136-701, Korea, Republic of
Tea Jin Kim
Affiliation:
[email protected], Korea University, Control and Instrumentation Engineering, Seoul, 136-701, Korea, Republic of
Moon Sik Kang
Affiliation:
[email protected], Korea University, Bio-Microsystem Technology, Seoul, 136-701, Korea, Republic of
Kum Pyo Yoo
Affiliation:
[email protected], Korea University, Control and Instrumentation Engineering, Seoul, 136-701, Korea, Republic of
Nam Ki Min
Affiliation:
[email protected], Korea University, Bio-Microsystem Technology, Anam-dong Seongbuk-Gu, Seoul, 136-701 Korea, Seoul, N/A, Korea, Republic of
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Abstract

Polyimides thin films, which are the most commonly used group of sensing materials for capacitive humidity sensors, were cured locally using MEMS microhotplates. The polyimide locally cured at temperature over 350 °C for 1 hour was fully cured. There were no significant differences in the polyimide thin films between cured in convection ovens and locally cured on microhotplate. The locally cured polyimide humidity sensor showed a linearity of 0.9995, a sensitivity of 0.766pF/%RH, a hysteresis of 0.6%RH, and a time response of 3 s. These results show the possibility of locally-cured polyimide films as high speed, high-sensitivity humidity sensors.

Keywords

sensorpolymermicroelectro-mechanical (MEMS)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1075: Symposium J – Passive and Electromechanical Materials and Integration , 2008 , 1075-J07-04
Copyright
Copyright © Materials Research Society 2008

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References

REFERENCES

1. Chen, Z. and Lu, C. Sensor Lett., 3, 274–295 (2005).Google Scholar
2. Shibata, H. Ito, M. and Watanabe, K. IEEE Trans. Instrum. Meas. 45, 564–568 (1996).Google Scholar
3. Cavicchi, R.E. Semancik, S. and Taylor, C.J. J. Electroceramics 9, 155–164 (2002).Google Scholar
4. Beckel, D. Briand, D. Hütter, A.B., Courbat, J. Rooij, N.F. de and Gauckler, L., J. Power Sources 166, 143–148 (2007).Google Scholar
5. Kang, U. and Wise, K.D. IEEE Trans. Electron Devices 47, 702–710 (2000)Google Scholar
6. Pryde, C.A. J. Polymer Science: Part A: Polymer Chemistry 27, 711. (1989).Google Scholar