Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-28T22:20:29.655Z Has data issue: false hasContentIssue false

High-Performance of Half-Heusler MNiSn (M=Hf,Zr) Single-Phase Thermoelectric Alloys Fabricated using Optical Floating Zone Melting

Published online by Cambridge University Press:  01 February 2011

Yoshisato Kimura
Affiliation:
[email protected], Tokyo Institute of Technology, Materials Science and Engineering, 4259-G3-23 Nagatsuta, Midori-ku, Yokohama, Kanagawa, 226-8502, Japan, +81-45-924-5495, +81-45-924-5495
Tomoya Kuji
Affiliation:
Akihisa Zama
Affiliation:
Yasufumi Shibata
Affiliation:
[email protected], Toyota Motor Corporation, Japan
Yoshinao Mishima
Affiliation:
Get access

Abstract

We have succeeded to grow almost single-phase of Half-Heusler intermetallic compounds MNiSn, where M = (Hfx,Zr1−x) and x varies from 0 to 1, for the first time by directional solidification using optical floating zone melting (OFZ). Thermoelectric power and electrical resistivity can be dramatically improved since OFZ process effectively reduces solidification defects such as micro-cracks and cavities as well as unfavorable coexisting phases. Dimensionless thermoelectric figure of merit, ZT, of OFZ (Hf,Zr)NiSn alloys can be improved effectively by lowering the lattice thermal conductivity through the solid solution effects due to the substitution of Hf and Zr with each other. The maximum ZT value of 0.9 is achieved in (Hf0.5Zr0.5)NiSn at 963 K.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Aliev, F. G., Brandt, N. B., Moshchalkov, V. V., Kozyrkov, V. V., Skolozdra, R. V. and Belogorokhov, A. I., Z. Phys. B: Condens. Matter 75, 167 (1989).Google Scholar
2 Tritt, T. M., Bhattacharya, S., Xia, Y., Ponnambalam, V., Poon, S. J. and Thadhani, N., Appl. Phys. Lett. 81, 43 (2002).Google Scholar
3 Katayama, T., Kim, S.-W., Kimura, Y. and Mishima, Y.: J. Electronic Mater., 32, 1160 (2003).Google Scholar
4. Hayashi, Y., Kim, S.-W., Kimura, Y. and Mishima, Y.: Proc. of TMS Symp. on Advanced Materials for Energy Conversion II, TMS, Warrendale, PA, 367 (2004).Google Scholar
5. Kim, S.-W., Kimura, Y. and Mishima, Y.: Proc. of TMS Symp. on Advanced Materials for Energy Conversion II, TMS, Warrendale, PA, 377 (2004).Google Scholar
6. Uher, C., Yang, J, Hu, S., Morelli, D. T. and Meisner, G. P., Phys. Rev. B, 59, 8615 (1999).Google Scholar
7. Hohl, H., Ramirez, A., Goldmann, C. and Ernst, G., J. Phys.: Condens. Mater, 11, 1697 (1999).Google Scholar
8. Shen, Q., Chen, L., Goto, T., Hirai, T., Yang, J., Meisner, G. P. and Uher, C., Appl. Phys. Lett. 79, 4165 (2001).Google Scholar
9. Katsuyama, S., Matsushima, H. and Ito, M., J. Alloys and Compounds, 385, 232 (2004).Google Scholar
10. Sakurada, S. and Shutoh, N., Appl. Phys. Lett. 85, 1140 (2004).Google Scholar
11. Kurosaki, K., Maekawa, T., Muta, H. and Yamanaka, S., J. Alloys and Compounds, 397, 296 (2005).Google Scholar