Hostname: page-component-745bb68f8f-5r2nc Total loading time: 0 Render date: 2025-02-04T15:14:23.238Z Has data issue: false hasContentIssue false
  • English
  • Français

High Resolution Electron Microscopy of Twist Grain Boundaries

Published online by Cambridge University Press:  21 February 2011

William Krakow
William Krakow*
Affiliation:
IBM Corporation, T.J. Watson Research Center, P.O.Box 218, Yorktown Heights, New York 10598.
Get access

Abstract

Preliminary experimental high resolution micrographs have been obtained for a Au thin film containing a [001], Σ=5 (θ=36.5 °) twist boundary. Other twist boundary cases such as the [001], Σ=13 (θ= 22.6°) and [111] low angle (˜3°) have also been fabricated. In order to assess whether the atomistic boundary structure is being imaged, extensive computer simulations of the Σ=5 bicrystal images have also been undertaken. Structurally, several contributions to the scattering must be considered which include: both upper and lower surface layers, bulk contributions above and below the interface and the relaxed interfacial structure at the composite film midplane. The effect of specimen orientation on image features is also evaluated for dynamical diffraction conditions. Likewise, the types of image features which arise by including bulk lattice reflections or alternately including only the reflections arising from the interface and surfaces will be discussed. Several schemes for analyzing twist boundary structures flat-on or near flat-on will be presented for a wide range of microscope conditions for a 400 kV microscope.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 139: Symposium R – High Resolution Microscopy of Materials , 1989 , 103
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Krakow, W. and Smith, D. A., J. Mater. Res. 1 (1986) 47.Google Scholar
2. Krakow, W. Wetzel, J.T. and Smith, D.A., Phil. Mag. 53 (1986) 739.Google Scholar
3. Krakow, W. and Smith, D.A., Ultramicroscopy 22 (1987) 47.Google Scholar
4. Schober, T. and Balluffi, R.W., Phil. Mag. 21 (1970) 109.CrossRefGoogle Scholar
5. Sass, S.L., Tan, T.Y. and Balluffi, R.W., Phil. Mag. 31 (1975) 559.Google Scholar
6. Gaudig, W., Guan, D.Y. and Sass, S.L., Phil. Mag. 34 (1976) 923.Google Scholar
7. Fitzsimmons, M.R. and Sass, S.L., Acta Met. (1988) in Press.Google Scholar
8. Fitzsimmons, M.R. Sass, S.L., Submitted for Publication (1988).Google Scholar
9. Wang, G.-J., Schwartz, D., Oh, Y. and Vitek, V., Grain Boundary and Related Phenomena, Proc. Of JIMIS–4 (1980). Suppl. to Japan Inst. Metals, p.155.Google Scholar
10. Vitek, V. and DeHosson, Th. M. Mat. Res. Soc. Symp. Proc., 63 (Materials Research Society, 1985) p. 137.Google Scholar
11. Vitek, V., Sutton, A.P., Wang, G.-J. and Schwartz, D., Scripta Met. 17 (1983) 183.Google Scholar
12. Mader, W., Necker, G., and Balluffi, W., Proc Lake Placid Conf. on Grain Boundaries and Interfaces, to be published in J. de Physique Conf. Issue (1988).Google Scholar
13. Mader, W., Necker, G., Babcock, S.E., and Balluffi, R.W., Scripta Met., 21 (1987) 555.Google Scholar
14. Krakow, W., J. of Diffusion and Defect Data Suppl. (Eds. Gupta, , Romig, and Dyanada, , 1988) 151.Google Scholar
15. Krakow, W., Ultramicroscopy, 4 (1979) 55.Google Scholar