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High Performance Conductive Adhesives for Lead-Free Interconnects

Published online by Cambridge University Press:  26 February 2011

Yi Li  and
ChingPing Wong
Yi Li
Affiliation:
[email protected], Georgia Institute of Technology, Materials Science and Engineering, Atlanta, GA, 30332-0245, United States, 404-894-8391
ChingPing Wong
Affiliation:
[email protected], Georgia Institute of Technology, Materials Science and Engineering, Atlanta, GA, 30332, United States
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Abstract

Tin-lead solder alloys are widely used in the electronic industry. With the recognition of toxicity of lead, however, electrically conductive adhesives (ECAs) have been considered as one of the most promising alternatives of tin-lead solder. While silver is the most widely used conductive fillers for ECA, silver migration has been the major concern for the high power and fine pitch applications. In this paper, a novel approach of using self-assembled monolayers (SAMs) passivation has been introduced to control the silver migration in nano-Ag ECAs. The protection of silver nano particles with SAMs reduced the silver migration dramatically and no migration was observed upon application of high voltages (up to 500 V) due to the formation of surface chelating compounds between the SAM and nano silver fillers. Unlike other migration control approaches which sacrifice electrical performance, the SAM passivated nano Ag fillers also enhanced the electrical conductivity and current carrying capability of adhesive joints significantly due to the improved interfacial properties and high current density of those molecular monolayers. The joint resistance of the SAM incorporated nano-Ag conductive adhesive could be achieved as low as 10−5 Ohm (the contact area is 100 ×100 μm2) and the maximum allowable current was higher than 3500 mA. As such, a fine pitch, high performance, non-migration and high reliability adhesives are developed for potential solder replacement in high voltage, high power device applications.

Keywords

adhesiveelectromigrationelectrical properties
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V07-01
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1. Li, Y., Moon, K., Wong, C. P., Science, 308 (2005) 1419–1420.Google Scholar
2. Hwang, J. S., (Ed.) Environment-Friendly Electronics: Lead-free Technology, Electrochemical Publications Ltd., Port Erin, UK, 2001; Chapter 1, pp 4–10.Google Scholar
3. Lau, J., Wong, C. P., Lee, N. C., Lee, S. W. R., in Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials; McGraw Hill, New York, NY, 2002.Google Scholar
4. Li, Y. and Wong, C. P., Mat. Sci. Eng. R., 51 (2006) 1–35.Google Scholar
5. Lin, J. C., Chan, J. Y., Mater. Chem. Phys. 1996, 43, 256.Google Scholar
6. Boden, P. J., IEEE Trans. on Comp. Packag. Manufact. Techno. B. 1994, 17, 83.Google Scholar
7. DiGiacomo, G., Reliability of Electronic Packages and Semiconductor Devices. New York: McGraw-Hill, 1997.Google Scholar
8. Li, Y., and Wong, C. P., U.S. Patent pending, GTRC Invention No. 3642 (2005)Google Scholar
9. Ulman, A., Chem. Rev. 1996, 96, 1533.Google Scholar
10. Moskovits, M., Suh, J. S., J. Am. Chem. Soc. 1985, 107, 6826.Google Scholar
11. Joo, S. W., Han, S. W., Han, H. S., Kim, K., J. Raman Spectrosc. 2000, 31, 145.Google Scholar
12. Tao, Y-T, J. Am. Chem. Soc. 1993, 115, 4350.Google Scholar