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Germanium & Carbon Co-implantation for Enhanced Short Channel Effect Control in PMOS Devices

Published online by Cambridge University Press:  01 February 2011

Benjamin Dumont
Affiliation:
[email protected], STMicroelectronics, Advanced Devices Module, 850, rue Jean Monnet, Crolles, N/A, 38926, France
Arnaud Pouydebasque
Affiliation:
[email protected], Philips Semiconductors, 850 rue Jean-Monnet, Crolles, N/A, 38926, France
Bartek Pawlak
Affiliation:
[email protected], Philips Research, Kapeldreef 75, B-3001, Leuven, N/A, N/A, Belgium
Benjamin Oudet
Affiliation:
[email protected], STMicroelectronics, 850 rue Jean-Monnet, Crolles, N/A, 38920, France
Dominique Delille
Affiliation:
[email protected], Philips Semiconductors, 850 rue Jean-Monnet, Crolles, N/A, 38926, France
Frederic Milesi
Affiliation:
[email protected], Ion Beam Services, ZI Peynier-Rousset, rue Gaston Imbert prolongée, Peynier, N/A, 13790, France
Kader Souifi
Affiliation:
[email protected], LPM - INSA de Lyon, Bât. Blaise Pascal, 7, avenue Jean Capelle, Villeurbanne, N/A, 69621, France
Thomas Skotnicki
Affiliation:
[email protected], STMicroelectronics, 850 rue Jean-Monnet, Crolles, N/A, 38920, France
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Abstract

This work demonstrates the efficiency of a Germanium and Carbon co-implantation that suppresses the Boron Transient Enhanced Diffusion, enhances Boron activation and enables large improvement of Short Channel Effects in PMOS devices while maintaining drive current performances. We present here 65/45nm node devices on conventional bulk substrates featuring Germanium and Carbon engineered shallow junctions that enable to reduce the Drain Induced Barrier Lowering compared to devices implanted only with Boron. This improvement is attributed to the suppression of Boron channelling with Ge pre-amorphization (PAI), and to the reduction of Boron TED due to the trapping of interstitial defects by Carbon with Germanium PAI.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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