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Free-form 2.5D thermoplastic circuits using one-time stretchable interconnections

Published online by Cambridge University Press:  30 June 2015

Jan Vanfleteren ,
Bart Plovie ,
Yang Yang ,
Jelle De Smet ,
Rik Verplancke ,
Frederick Bossuyt  and
Herbert De Smet
Jan Vanfleteren
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
Bart Plovie
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
Yang Yang
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
Jelle De Smet
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
Rik Verplancke
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
Frederick Bossuyt
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
Herbert De Smet
Affiliation:
imec - Ghent University, Gent-Zwijnaarde, Belgium
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Abstract

A technology is presented for the production of soft and rigid circuits with an arbitrary 2.5D fixed shape. The base of this technology is our proprietary technology for elastic circuits with a random shape, in which the elastic thermoset (mostly PDMS) polymer is now replaced by soft or rigid thermoplastic variants. An additional thermoforming step is required to transform the circuit from its initial flat to its final fixed 2.5D shape, but for rigid fixed shape circuits only one-time stretchability of the extensible interconnects is required, relieving the reliability requirements.

Keywords

electronic materialelectronic structurepolymer
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1798: Symposium LL – Soft Electronics―From Electronic Skin to Reliable Neural Interfaces , 2015 , mrss15-2137794
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Sekitani, T., Nakajima, H., Maeda, H., Fukushima, T., Aida, T., Hata, K., and Someya, T., Nat. Mater. 8, 494 (2009).CrossRefGoogle Scholar
Graz, I.M., Cotton, D.P.J., Robinson, A., Lacour, S.P., Appl. Phys. Lett. 98, 124101 (2011).CrossRefGoogle Scholar
Kim, D.-H., Song, J., Choi, W.M., Kim, H.-S., Kim, R.-H., Liu, Z., Huang, Y.Y., Hwang, K.-C., Zhang, Y., and Rogers, J.A., Proc. Natl. Acad. Sci. U.S.A. 105, 18675 (2008).CrossRefGoogle Scholar
Vanfleteren, J., Gonzalez, M., Bossuyt, F., Hsu, Y.-Y., Vervust, T., De Wolf, I., and Jablonski, M., MRS Bull. 37, 254 (2012).CrossRefGoogle Scholar
Vanfleteren, J., Chtioui, I., Plovie, B., Yang, Y., Bossuyt, F., Vervust, T., Dunphy, S., Vandecasteele, B., Proc. Technology 15, 208 (2014).CrossRefGoogle Scholar