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Enhancing the Interfacial Bond Strength of Lignocellulosic Fiber Dispersed in Synthetic Polymer Matrices

Published online by Cambridge University Press:  15 February 2011

John Simonsen  and
Tim Rials
John Simonsen
Affiliation:
Oregon State University, Forest Products, Corvallis, Oregon
Tim Rials
Affiliation:
USDA Southern Forest Experiment Station, Pineville, Louisiana
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Abstract

Wood-plastic composites have been produced utilizing a phenol-formaldehyde pretreatment of the wood. The use of additives to cross link the plastics and increase the interfacial bond between the wood and plastic were also investigated. These preliminary results suggest that pretreatment of the wood with a thermosetting resin may increase the stiffness of the composite. The use of an octylphenol as a plastic compatabilizer did not reliably increase stiffness in this system, although additional study is warranted. An interaction between the wood and the polystyrene in the plastic mixture may be indicated.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 266: Symposium LA – Materials Interactions Relevant to Recycling of Wood-Based Materials , 1992 , 105
Copyright
Copyright © Materials Research Society 1992

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References

1. Luneke, D.L. (private communication).Google Scholar
2. Leichti, R.L. (private communication).Google Scholar
3. Woodhams, R.T., Thomas, G., and Rodgers, D.K., Polymer Engineering and Science. 24(15), 1166–1171 (1984).CrossRefGoogle Scholar
4. Maldas, D., Kokta, B.V., and Daneault, C., J. of Applied Polymer Sci., 37, 751–775 (1989).CrossRefGoogle Scholar
5. Han, G., et. al., Mokuzai Gakkaishi 35 (12) 1100–1104 (1989).Google Scholar
6. Coran, A.Y.and Patel, R., U.S. Patent 4,323,625.Google Scholar