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Electrochemical Deposition of Platinum Interconnects on Flexible Biocompatible Substrates

Published online by Cambridge University Press:  14 January 2014

A. Radisic ,
B. M. Morcos ,
M. Op de Beeck ,
J. M. O’Callaghan  and
C. Van Hoof
A. Radisic
Affiliation:
imec, Kapeldreef 75, Leuven, Belgium
B. M. Morcos
Affiliation:
imec, Kapeldreef 75, Leuven, Belgium KACST-Intel Consortium CENA, Riyadh, Saudi Arabia Chemistry Department, Faculty of Science, Alexandria University, Egypt
M. Op de Beeck
Affiliation:
imec, Kapeldreef 75, Leuven, Belgium
J. M. O’Callaghan
Affiliation:
imec, Kapeldreef 75, Leuven, Belgium
C. Van Hoof
Affiliation:
imec, Kapeldreef 75, Leuven, Belgium
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Abstract

We explored the use of galvanostatic electrochemical deposition of Pt for cost-effective fabrication of interconnects in flexible implantable bio-medical devices. Initial studies were done on coupons diced from 200 mm Si wafers coated with PVD TiN. Based on the physical and chemical properties of the electrodeposited Pt films, optimal conditions were chosen for through-mask plating of centimeters long Pt lines on flexible, medical grade, releasable polyimide layers. Possibility for further up-scaling was considered with special emphasis on high throughput manufacturing of Pt interconnects with good adhesion to TiN/flexible substrates, low impurity content and resistivity, and acceptable roughness and uniformity.

Keywords

electrodepositionPtmicroelectronics
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1626: Symposium K – Adaptive Soft Matter through Molecular Networks , 2014 , mrsf13-1626-k10-07
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

Cowley, A. and Woodward, B., Platinum Metals Review, 55, 98 (2011).CrossRefGoogle Scholar
Op de Beeck, M., O’Callaghan, J., Qian, K., Morcos, B.M., Radisic, A., Malachowski, K., Amira, M.F., Hoof, C.V., in Proceedings of the IMAPS San Diego, CA, USA, 45 215 (2012).Google Scholar
Op de Beeck, M., Qian, K., Fiorini, P., Malachowski, K., Hoof, C.V., in Proceedings of the IMAPS Long Beach, CA, USA, 44, 152 (2011).Google Scholar
Whalen, J. J., Weiland, J. D., and Searson, P. C., J. Electrochem. Soc., 152, C738 (2005).CrossRefGoogle Scholar
Saenger, K. L., Costrini, G., Kotecki, D. E., Kwietniak, K. T., and Andricacos, P. C., J. Electrochem. Soc., 148, C758 (2001).CrossRefGoogle Scholar
Morcos, B. M., O’Callaghan, J. M., Amira, M. F., Van Hoof, C., and Op de Beeck, M., J. Electrochemical Soc., 160, D300 (2013).CrossRefGoogle Scholar
Radisic, A., Morcos, B. M., Op de Beeck, M., O’Callaghan, J. M., Van Hoof, C., Microelectron. Eng. (2013), http://dx.doi.org/10.1016/j.mee.2013.07.004.Google Scholar
Milchev, A. and Irene Montenegro, M., J. Electroanal. Chem., 333, 93 (1992).CrossRefGoogle Scholar