Hostname: page-component-586b7cd67f-tf8b9 Total loading time: 0 Render date: 2024-12-01T08:54:57.451Z Has data issue: false hasContentIssue false

Effect of Surface Oxide Layer on Mechanical Properties of Single Crystalline Silicon

Published online by Cambridge University Press:  01 February 2011

Kenji Miyamoto
Affiliation:
[email protected], Kyoto University, Microengineering, Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan
Koji Sugano
Affiliation:
[email protected], Kyoto University, Microengineering, Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan
Toshiyuki Tsuchiya
Affiliation:
[email protected], Kyoto University, Microengineering, Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan
Osamu Tabata
Affiliation:
[email protected], Kyoto University, Microengineering, Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan
Get access

Abstract

Fatigue fracture under cyclic loading of single crystal silicon (SCS) is concerned and fatigue properties and mechanism are investigated widely. Surface oxide is considered to have an important role on fatigue fractures. In this paper, the tensile testing of SCS whose surface was intentionally oxidized and the effect of the oxide thickness on the mechanical properties were reported. After fabrication of SCS specimens, they were oxidized in dry oxidization at 1100 ºC. Quasi-static tensile testing of SCS specimens with no, 100-nm-oxide, and 200-nm-oxide thick oxide was performed. As the results, the deviation in fracture strain was decreased by oxidation, and the fracture origin was observed to be the inner silicon part. These results might be caused by the decrease of surface roughness and defects formation by oxygen precipitation during thermal oxidation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2008

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Muhlstein, C.L, Brown, S.B, Ritchie, R.O, Acta Mater. 50, 3579 (2002).Google Scholar
2 Kahn, H., Ballarini, R., Bellante, J., Heuer, A.H, Science. 1215 (2002).Google Scholar
3 Yamaji, Y., Proceedings of the MEMS'2007, Kobe, Japan. 267 (2007).Google Scholar
4 Fitch, J.T, Bjorkman, C.H, and Lucovsky, G., J.Vac. Sci Technol. B 7, 775 (1989).Google Scholar
5 Yoshioka, T., Ando, T, Shikida, M, Sato, K, Sensors and Actuators. 82, 291 (2000).Google Scholar
6 Orowan, E., Rep. Prog. Phys. 12, 185 (1948).Google Scholar
7 Borghesi, A., BPivac, , Sassella, A., and Stella, A., J. Appl. Phys. 77 (9), 4169 (1995).Google Scholar
8 Livingston, F.M, Messoloras, S, Newman, R C, Pike, B. C, Stewrt, R.J, Brown, W. P, and Wilkes, J.G., J. Phys. C 17. 6253 (1984)Google Scholar