Hostname: page-component-78c5997874-lj6df Total loading time: 0 Render date: 2024-11-09T22:32:57.409Z Has data issue: false hasContentIssue false
  • English
  • Français

The Effect of Interfacial Free Energies on the Stability of Microlaminates

Published online by Cambridge University Press:  21 March 2011

A. C. Lewis ,
A. B. Mann ,
D. van Heerden ,
D. Josell  and
T. P. Weihs
A. C. Lewis
Affiliation:
Dept. of Materials Science & Engineering, The Johns Hopkins University, Baltimore, MD, USA
A. B. Mann
Affiliation:
Dept. of Materials Science & Engineering, The Johns Hopkins University, Baltimore, MD, USA Currently atUniversity of Manchester and UMIST, Manchester, UK
D. van Heerden
Affiliation:
Dept. of Materials Science & Engineering, The Johns Hopkins University, Baltimore, MD, USA
D. Josell
Affiliation:
National Institute of Standards and Technology, Gaithersburg, MD, USA
T. P. Weihs
Affiliation:
Dept. of Materials Science & Engineering, The Johns Hopkins University, Baltimore, MD, USA
Get access

Abstract

Laminated composites with polycrystalline layers typically break down at high temperatures through grain boundary grooving and the pinch-off of individual layers. Such materials, when exposed to high temperatures, develop grooves where grain boundaries meet the interfaces between layers. The depths of the grooves are controlled by the ratios of grain boundary and interfacial free energies, γgb/γint. Depending on the dimensions of the grains, these grooves can extend through the entire layer, causing pinch-off at the grain boundary. This pinch-off destroys the layering and eventually leads to a gross coarsening of the microstructure. Because microstructural stability is critical to performance for most applications, the ability to understand and predict the stability of microlaminates is a necessary tool. An existing model of this capillarity-driven breakdown requires the interfacial free energies, γgb and γint, as input parameters. Both biaxial and uniaxial zero creep tests have been used in conjunction with transmission electron microscopy to measure these interfacial energies in Ag/Ni and Nb/Nb5Si3 microlaminates.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 652: Symposium Y – Influences of Interface & Dislocation Behavior on Microstructure Evolution , 2000 , Y1.3
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Sridhar, N., Rickman, J.M. and Srolovitz, D.J., Acta mater., 45(7) 2715, (1997).Google Scholar
2. Carel, R., Thompson, C.V. and Frost, H.J., Acta mater., 44(6) 2479, (1996).Google Scholar
3. Josell, D. and Wang, Z.L.., Mat. Res. Soc. Symp. Proc., 235, (1995).Google Scholar
4. Josell, D. and Spaepen, F., Acta Metall. et Mater., 41(10) 3007–3015, (1993).Google Scholar
5. Josell, D. and Spaepen, F., Acta Metall. et Mater., 41(10) 3017–3027, (1993).Google Scholar
6. Nix, W.D., Metall. Trans., 20A, 2217, (1989).Google Scholar
7. Josell, D. and Carter, W.C., in Creep and Stress Relaxation, edited by Merchant, H.D. (TMS, 1997) p. 271.Google Scholar
8. Josell, D., Carter, W.C. and Bonevich, J.E., Nanostruct. Materials, 12, 387–390, (1999).Google Scholar
9. Lee, H.J. et al. , Acta Mat., 47(15-16), 3965, (1999).Google Scholar
10. Snoeck, E. et al. , J. Magn. Magn. Mat., 151(24), (1995).Google Scholar
11. Troche, P. et al. , Thin Solid Films, 353(33), (1999).Google Scholar
12. Heerden, D. Van et al. , Metal Trans. (submitted), (2000).Google Scholar
13. Rowe, R.G. et al. , Scripta Metall. et Mater., 31, 1487, (1994).Google Scholar
14. Weihs, T.P. and Barbee, T.W., Acta Mater., 45, 2307, (1997).Google Scholar
15. Murr, L.E., Interfacial Phenomena in Metals and Alloys. (Addison-Wellesly, 1975).Google Scholar
16. Josell, D., Acta Metall. et Mater., 42(3), 1031–1038, (1994).Google Scholar
17. Mann, A.B. et al. , Rev. Sci. Instr. (submitted), (2000).Google Scholar
18. Lewis, A.C. et al. , Mater. Res. Soc. Proc., 586, (1999).Google Scholar