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Dispersion Engineering of Three-Dimensional Silicon Photonic Crystals: Fabrication and Applications

Published online by Cambridge University Press:  26 February 2011

Sriram Venkataraman ,
Garrett Schneider ,
Janusz Murakowski ,
Shouyan Shi  and
Dennis W. Prather
Sriram Venkataraman
Affiliation:
Electrical Engineering, University of Delaware, Newark, DE
Garrett Schneider
Affiliation:
Electrical Engineering, University of Delaware, Newark, DE
Janusz Murakowski
Affiliation:
Electrical Engineering, University of Delaware, Newark, DE
Shouyan Shi
Affiliation:
Electrical Engineering, University of Delaware, Newark, DE
Dennis W. Prather
Affiliation:
Electrical Engineering, University of Delaware, Newark, DE
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Abstract

In this paper, we propose the design and fabrication of buried silicon optical interconnect technology, the sub-surface silicon optical bus (S3B). The proposed approach relies on engineering the dispersion properties of embedded silicon three-dimensional photonic crystals to create sub-micron routing channels and control light propagation. Further, we present a method for the fabrication of buried three-dimensional (3D) photonic-crystal structures using conventional planar silicon micromachining. The method utilizes a single planar etch mask coupled with time-multiplexed, sidewall-passivating, deep anisotropic reactive-ion etching, to create an array of spherical voids with three-dimensional symmetry. Preliminary results are presented that demonstrate the feasibility of realizing chip-scale optical interconnects using our proposed approach.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 829: Symposium B – Progress in Compound Semiconductor Materials IV – Electronic and Optoelectronic Applications , 2004 , B5.9
Copyright
Copyright © Materials Research Society 2005

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References

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