Hostname: page-component-78c5997874-8bhkd Total loading time: 0 Render date: 2024-11-03T02:02:39.486Z Has data issue: false hasContentIssue false

Development of Polyimide-based Flexible Tactile Sensing Skin

Published online by Cambridge University Press:  11 February 2011

Jonathan Engel
Affiliation:
Micro and Nanotechnology Laboratory
Jack Chen
Affiliation:
Micro and Nanotechnology Laboratory
Chang Liu
Affiliation:
Micro and Nanotechnology Laboratory
Bruce R. Flachsbart
Affiliation:
Micro-Miniature Systems Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, IL 61801USA
John C. Selby
Affiliation:
Micro-Miniature Systems Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, IL 61801USA
Mark A. Shannon
Affiliation:
Micro-Miniature Systems Laboratory, University of Illinois at Urbana-Champaign, 208 N. Wright St., Urbana, IL 61801USA
Get access

Abstract

We present a novel microfabrication process for realizing a new type of flexible sensory “smart skin”. In this work, we focus on demonstration of a skin containing a two dimensional array of tactile sensors using polyimide and metal strain gauges. A novel polymer microfabrication approach coupled with surface release methods is demonstrated. The process yields flexible sensory skins in a low cost, efficient manner. Experimental characterization of the devices is also presented. The demonstrated sensors use metal-film strain gauges in a multiplexed two-dimensional array of tactile pixels (taxels) embedded in a polyimide thin film membrane to detect force distribution on the flexible skin. The arrays have been used to image force distributions and could be used with slip-detection friction measurement for robotic gripping application.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Lee, M.H. and Nicholls, H.R., “Tactile sensing for mechatronics - a state of the art surveyMechatronics 9 133 (1999).Google Scholar
Kane, B.J., Cutkosky, M.R., Kovacs, T. A., “A traction stress sensor array for use in high-resolution robotic tactile imagingJMEMS 9 425434 (2000).Google Scholar
[3] Beebe, DJ., Hsieh, A.S., Denton, D.D. and Radwin, R.G., “A silicon force sensor for robotics and medicineSensors and Actuators A 50 5556 (1995).Google Scholar
[4] Gray, B.L. and Fearing, R.S., “A surface micromachined microtactile sensor array” Proc 1996 IEEE Int 'l Conf. On Robotics and Automation (Minneapolis, MN) 16 (1996).Google Scholar
[5] Leineweber, M., Pelz, G., Schmidt, M., Kappert, H., Zimmer, G., “New tactile sensor chip with silicone rubber coverSensors and Actuators A 84 236245(2000).Google Scholar
[6] Kolesar, E.S. and Dyson, C.S., “Object imaging with a piezoelectric robotic tactile sensorJMEMS 4 8796 (1995).Google Scholar
[7] Reston, R.R. and Kolesar, E.S., “Robotic tactile sensor array fabricated from a piezoelectric polyvinylidene fluoride filmProc. 1990 IEEENAECON 3 1139–114(1990).Google Scholar
[8] Jiang, F., Tai, Y-C., Walsh, K., Tsao, T., Lee, G-B., Ho, C-M., “A flexible MEMS technology and its first application to shear stress sensor skinProc 1997 IEEE Int'l Conf. On MEMS 465470 (1997).Google Scholar
[9] Beebe, D.J. and Denton, D.D., “A flexible polyimide-based package for silicon sensorsSensors and Actuators A 44 5764 (1994).Google Scholar
[10] Cao, L., Kim, T.S., Zhou, J., Mantell, S.C., Polla, D.L., “Calibration technique for MEMS membrane type strain sensorsProc. 1999 IEEE Symposium on Microelectronics 204210 (1999).Google Scholar
[11] Shimizu, T., Shikida, M., Sato, K., Itoigawa, K., “A new type of tactile sensor detecting contact force and hardness of an object2002 Proc 2002 IEEE Conf. On MEMS 1 344347 (2002).Google Scholar
[12] Nakamura, Y., Suzuki, Y., Watanabe, Y., “Effect of oxygen plasma etching on adhesion between polyimide films and metalThin Solid Films 290–291 367369 (1996).Google Scholar
[13] Caterer, M.D., Daubenspeck, T.H., Ference, T.G., Holmes, S.J., Quinn, R.M., “Processing thick multilevel polyimide films for 3-D stacked memoryIEEE Transactions on Advanced Packaging 22 189199 (1999).Google Scholar