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Design and Development of MBE Grown AlGaN/ GaN HEMT Devices on SiC Substrates for RF Applications

Published online by Cambridge University Press:  01 February 2011

Ashok K Sood
Affiliation:
[email protected], Magnolia Optical Technologies, Inc., 52-B,Cummings Park, Suite 314, Woburn, MA, 01801, United States, 781-503-1200 x105, 781-932-0847
Rajwinder Singh
Affiliation:
[email protected], Magnolia Optical Technologies, Inc., United States
Yash R Puri
Affiliation:
[email protected], Magnolia Optical Technologies, Inc., United States
Frederick W Clarke
Affiliation:
[email protected], US Army Space and Missile Defense Command, United States
Amir Dabiran
Affiliation:
[email protected], SVT Associates, Inc., United States
Peter Chow
Affiliation:
[email protected], SVT Associates, Inc., United States
Jie Deng
Affiliation:
[email protected], Lehigh University, EE Depatment, United States
James C.M. Hwang
Affiliation:
[email protected], Lehigh University, EE Depatment, United States
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Abstract

GaN /AlGaN transistors are being developed for a variety of RF electronic and high temperature electronics applications that will replace GaAs and Silicon based devices and amplifiers for commercial and military applications. In this paper, we present GaN/AlGaN based HEMT device architectures on SiC substrates with simulation and modeling results. The HEMT epitaxial layers were grown using RF Plasma Assisted MBE Technique. This approach has demonstrated very uniform epitaxial layers. The key to high performance HEMTs is the ability to grow high quality (Al)GaN buffer layers. Details of the electrical and optical characteristics of the HEMT wafers are presented. In addition, we will present results on an modified (ICP) etching technique that allows for low damage device processing and improved reliability.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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References

REFERENCES

1. Feng, M. et al. “Device techniques for RF Front-End Circuits in next generation wireless communicationsA Review Paper, Proceedings of the IEEE. Vol. 92, No 2, February 2004.Google Scholar
2. Clarke, F.W., Shur, M., Khan, M.A. et al. “Gate Current and Analytical Modeling in Insulating Gate III-N Hetero-Structure Field Effect transistors” Presented at the MRS Meeting, Dec. 2–6, 2002 (Boston), Published in MRS Proceedings on GaN (2003).Google Scholar
3. Manfra, M.J. et al. “High Quality AlGaN /GaN HEMTs Grown by MBE on Semi-Insulating Silicon Carbide” Presented at the MRS Meeting, Dec.2–6, 2002 (Boston), Published in MRS Proceedings on GaN (2003)Google Scholar
4. Sood, A.K., Clarke, F.W., Hwang, J.C.M., Dabiran, A., Souzis, A. et al. “Development of High Performance AlGaN / GaN High Electron Mobility Transistor for RF ApplicationsProceedings of SPIE, Volume 5550, 130144, 2004.CrossRefGoogle Scholar
5. Ambacher, O., “Two Dimensional Electron Gases Induced by Spontaneous and Piezoelectric Polarization in Undoped and Doped AlGaN/GaN Heterostructures”, J. Applied Phys., 87, pp. 334344, 2000 CrossRefGoogle Scholar
6. Ambacher, O., “Two Dimensional Electron Gases Induced by Spontaneous and Piezoelectric Polarization in N- and Ga-Face AlGaN/GaN Heterostructures”, J. Applied Phys., 85, pp. 32223233, 1999 CrossRefGoogle Scholar
7. Ambacher, O., “Electronics and sensors based on Pyroelectric AlGaN/GaN Hetero-structuresPhys. Stat. Sol., No. 6, 18781907 (2003)Google Scholar