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Delamination Trends of Underfill in Dca Assemblies

Published online by Cambridge University Press:  10 February 2011

Y. Sha ,
C.Y. Hui ,
E. J. Kramer ,
P. Borgesen  and
G. Westby
Y. Sha
Affiliation:
Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853
C.Y. Hui
Affiliation:
Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853
E. J. Kramer
Affiliation:
Materials Science and Engineering, Cornell University, Ithaca, NY 14853
P. Borgesen
Affiliation:
Surface Mount Technology Lab.Universal Instruments Corp., Binghamton, NY 13902
G. Westby
Affiliation:
Surface Mount Technology Lab.Universal Instruments Corp., Binghamton, NY 13902
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Abstract

Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 3
Copyright
Copyright © Materials Research Society 1997

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References

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