Hostname: page-component-78c5997874-s2hrs Total loading time: 0 Render date: 2024-11-08T00:04:57.521Z Has data issue: false hasContentIssue false

Crystallization Behavior and Electrical Properties of Wet-Chemically Deposited Lead Zirconate Titanate Thin Films

Published online by Cambridge University Press:  21 February 2011

S. Merklein
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D - 97082 Würzburg, Germany
D. Sporn
Affiliation:
Fraunhofer-Institut für Silicatforschung, Neunerplatz 2, D - 97082 Würzburg, Germany
A. SchÖnecker
Affiliation:
Fraunhofer-Einrichtung für Keramische Technologien und Sinterwerkstoffe, Winterbergstr. 28, D - 01194 Dresden, Germany
Get access

Abstract

A wet chemical deposition process for smooth and crackfree films in the system Pb(Zr 1-x Tix)O3 (PZT) has been developed. Final film thicknesses, reached with one coating step, were in the region of 1 μm. Starting from lead acetate trihydrate, zirconium- and titanium-n-propoxide, high molarity (> 2M) coating sols have been prepared that could be handled in air and were stable for more than 170 days.

Films with compositions near the morphotropic phase boundary (x=47) and various lead contents were deposited on Pt-coated Si-wafers and Al2O3-substrates by a spin-on method. Wet films could be pyrolyzed and densified with a fast heat treatment without cracking. The crystallization of films into the desired perovskite structure started at comparatively low temperatures (ca. 530 °C) and proceeded rapidly at temperatures above 650 °C. A slight molar excess of lead and a proper heating rate were found to produce films with the best electrical properties. The films on platinized A12O3 substrates showed device-worthy dielectric and ferroelectric properties with typical values for Pn, EC, and ε, of 24 μC/cm2, 4.5 KV/mm and 650, respectively.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Uhlmann, D.R., Teowee, G., Boulton, J.M., Motakef, S. and Lee, S.C., J. Non-Cryst. Solids 147&148 409 (1992).CrossRefGoogle Scholar
[2] Haertling, G.H. in Ferroelectric Films, edited by Bhalla, A.S. and Nair, K.M. (Am. Ceram. Soc. 25,1992) pp. 118.Google Scholar
[3] Phillips, N.J. and Milne, S.J., J. Mater. Chem. 1 893 (1991).CrossRefGoogle Scholar
[4] Mehotra, R.C., J. Non-Cryst. Solids 121 1 (1990).Google Scholar
[5] Schwartz, R.W., Assink, R.A. and Headly, T.J. in Ferroelectric Thin Films II, edited by Kingon, A.I., Myers, E.R. and Tuttle, B. (Mater. Res. Soc. Proc. 243, Pittsburgh, PA, 1992) pp. 245254.Google Scholar
[6] Lakeman, C.D., Campion, J.F. and Payne, D.A. in Ferroelectric Films, edited by Bhalla, A.S. and Nair, K.M. (Am. Ceram. Soc. 25,1992) pp. 413439.Google Scholar
[7] Papiernik, R., Hubert-Pfalzgraf, L.G. and Chaput, F., J. Non-Cryst. Solids 147&148 36(1992).CrossRefGoogle Scholar
[8] Teowee, G., Boulton, J.M. and Uhlmann, D.R. In Better Ceramics Through Chemistry V, edited by Hampden-Smith, M.J., Klemperer, W.G. and Brinker, C.J. (Mater. Res. Soc. Proc. 271, Pittsburgh, PA, 1992) pp. 345350.Google Scholar