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Cross-Plane Thermoelectric Properties in Si/Ge Superlattices

Published online by Cambridge University Press:  21 March 2011

Bao Yang
Affiliation:
Mechanical and Aerospace Engineering Department, Massachusetts Institute of Technology, Cambridge, MA 02139
Jian L. Liu
Affiliation:
Electrical Engineering Department, University of California, Los Angeles, CA 90095
Kang L. Wang
Affiliation:
Electrical Engineering Department, University of California, Los Angeles, CA 90095
Gang Chen
Affiliation:
Mechanical Engineering Department, Massachusetts Institute of Technology, Cambridge, MA 02139
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Abstract

In this paper, a set of methods is developed to measure the Seebeck coefficient, electrical conductivity, and thermal conductivity in the cross-plane direction of thin films. The method employs microfabricated heaters, voltage and temperature sensors, and phase-lock amplifiers to determine the temperature and Seebeck voltage oscillation in the cross-plane direction of the samples, from which the thermal conductivity and Seebeck coefficient of thin films are determined simultaneously. The cross-plane electrical conductivity is also measured by a modified transmission line model. These methods are applied to Si/Ge superlattices grown by molecular beam epitaxy.

Type
Research Article
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

[1] Hicks, L. D. and Dresselhaus, M. S., Phys. Rev. B 47, 12727 (1993).Google Scholar
[2] Hyldgaard, P. and Mahan, G. D., Phys. Rev. B 56, 10754 (1997).Google Scholar
[3] Chen, G., Phys. Rev. B 57, 14958 (1998).Google Scholar
[4] Balandin, A., Khitun, A., Liu, J. L., Wang, K. L., Borca-Tasciuc, T., and Chen, G., Proc. 18th Int. Conf. Thermoelectrics, ICT'99, 23 (1999).Google Scholar
[5] Koga, T., Cronin, S. B., Dresslehaus, M. S., Liu, J. L., and Wang, K. L., Appl. Phys. Lett. 77, 1490 (2000).Google Scholar
[6] Fan, X.F., Zeng, G.H., LaBounty, C., Bowers, J.E., Croke, E., Ahn, C.C., Huxtable, S., Majumdar, A., and Shakouri, A., Appl. Phys. Lett. 78, 1580 (2001).Google Scholar
[7] Liu, W. L., Borca-Tasciuc, T., Chen, G., Liu, J. L., and Wang, K. L., Nanosci, J.. and Nanotech. 1, 37 (2001).Google Scholar
[8] Borca-Tasciuc, T., Liu, W. L., Liu, J. L., Zeng, T. F., Song, D. W., Moore, C. D., Chen, G., Wang, K. L., Goorsky, M. S., Radetic, T., Gronsky, R., Koga, T., and Dresselhaus, M. S., Superlattices and Microstructure 28, 199 (2000).Google Scholar
[9] Venkatasubramanian, R., Phys. Rev. B 61, 3091 (2000).Google Scholar
[10] Mahan, G.D., J. Appl. Phys. 76, 4362 (1994).Google Scholar
[11] Vining, C. B. and Mahan, G. D., J. Appl. Phys. 86, 6852 (1999).Google Scholar
[12] Shakouri, A. and Bowers, J.E., Appl. Phys. Lett. 71, 1234, (1997)Google Scholar
[13] Venkatasubramanian, R., Siivola, E., Colpitts, T, and O'Ouinn, B., Nature 413, 597(2001).Google Scholar
[14] Goldsmid, H. J., Thermoelectric Refrigeration, London, Heywood (1964).Google Scholar
[15] Yao, T., Appl. Phys. Lett. 51, 1798 (1987).Google Scholar
[16] Beyer, H., Lambrecht, A., Nurnus, J., Bottner, H., and Griessmann, H., Heinrich, A., Schmitt, L., Blumers, M., and Volklein, F., Proc. 18th Int. Conf. Thermoelectrics, ICT'99, 687 (1999).Google Scholar
[17] Venkatasubramanian, R., Recent Trends in Thermoelectric Materials Research III, Tritt, T. M., Ed., Academic Press 71, 196 (2001).Google Scholar
[18] Cahill, D. G., Rev. Sci. Instrum. 61, 802 (1990).Google Scholar
[19] Cahill, D. G., Katiyar, M., and Abelson, J. R., Phys. Rev. B 50, 6077 (1994).Google Scholar
[20] Liu, J.L., Tang, Y.S., Wang, K.L., Radetic, T., and Goorsky, M. S., Appl. Phys. Lett. 74, 1863 (1999).Google Scholar
[21] Dismukes, J. P., Ekstrom, L., Steigmeier, E. F., Kudman, I., and Beers, D. S., J. Appl. Phys. 35, 2899 (1964).Google Scholar
[22] Yang, B. and Chen, G., Microscale Thermophys. Eng. 5, 107 (2001).Google Scholar
[23] Brinson, M. E. and Dunstan, W., J. Phys. C: Solid St. Phys. 3, 483 (1970).Google Scholar
[24] Broido, D.A. and Reinecke, T.L., Appl. Phys. Lett. 77, 705 (2000).Google Scholar
[25] Shockley, W., Report No. Al-Tor-64-207, Air Force Atomic Laboratory, Wright-Patterson Air Force Base, Ohio, September 1964.Google Scholar
[26] Berger, H. H., Solid-state Electronics 15, 145 (1972).Google Scholar