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Creep Study for Fatigue Life Assessment of Two Lead-Free High Temperature Solder Alloys

Published online by Cambridge University Press:  10 February 2011

J. Liang ,
P. S. Lee ,
N. Gollhardt ,
S. Schroeder  and
W. Morris
J. Liang
Affiliation:
Rockwell Automation, Rockwell International Corp., Milwaukee, WI 53204
P. S. Lee
Affiliation:
Rockwell Automation, Rockwell International Corp., Milwaukee, WI 53204
N. Gollhardt
Affiliation:
Rockwell Automation, Rockwell International Corp., Milwaukee, WI 53204
S. Schroeder
Affiliation:
Rockwell Science Center, Rockwell International Corp., Thousand Oaks, CA 91360
W. Morris
Affiliation:
Rockwell Science Center, Rockwell International Corp., Thousand Oaks, CA 91360
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Abstract

Creep of two lead-free high temperature solder alloys, 95Sn-5Ag and 99Sn-1.0Cu was studied in this investigation. Room and high temperature creep tests were performed to examine deformation mechanisms and to establish mathematical models of creep deformation for the alloys. A state variable creep model was introduced to model both primary and secondary creep deformation of these two alloys which show a very significant primary creep. Fatigue life models of the alloys were established based on an energy-based failure criteria, which was deduced from variable strain amplitude tests at a constant strain rate of 0.003/sec, and from variable strain rates tests with two constant strain amplitudes of 0.005 and 0.01. Applications of the creep model includes determination of peak loads and hysteresis strain energy density in strain-controlled fatigue tests. It is demonstrated that the creep model can be very helpful to establish fatigue failure criteria and to assess fatigue lives of these two alloys.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 307
Copyright
Copyright © Materials Research Society 1997

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References

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