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Copper-sulfide Passivation Capping for Cu Interconnects

Published online by Cambridge University Press:  01 February 2011

Uri Cohen
Uri Cohen*
Affiliation:
[email protected]
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Abstract

Copper-sulfide is proposed as a selective self-aligned passivation capping film on Cu lines, to improve the lines immunity against electromigration. Copper-sulfide is tenacious, having excellent adhesion (chemically bonded) to the underlying copper lines and strong adhesion to the overlying dielectric capping barrier. Contrary to other passivation schemes, Cu sulfidation is 100% selective. The sulfidation can be done by a wet or a dry process. A very thin copper-sulfide film (of about 25-100Å) will be required, and no significant increase of RC delay is expected.

Keywords

electromigrationCupassivation
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-F04-03
Copyright
Copyright © Materials Research Society 2010

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References

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