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Chemical Vapor Deposition by Pulsed Ultrasonic Direct Injection of Liquid Precursors Produces Versatile Method for Creation of Thin Film Circuits and Devices.

Published online by Cambridge University Press:  17 March 2011

Mark W. Leiby
Mark W. Leiby*
Affiliation:
Applications Engineer Sono-Tek Corporation Milton, New York 12547
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Abstract

We demonstrate a unique, ultrasonic direct injection method that employs nanophase materials (e.g. polymers, metal-organic and ceramic precursors). By use of in situ process control, and modification of process parameters, morphology, and structure may be varied to produce desired characteristics. By sequential application of these strategies one may fabricate MEMS, OLED's, deposit conformal coatings, create surface acoustic wave (SAW) chemical sensors, and many other thin film circuits and devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 698: Symposia Q/EE Electroative Polymers and Rapid Prototyping , 2001 , 1
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

1. Krumdieck, S., Kinetic Model of Low Pressure Film Deposition From Single Precursor Vapor In A Well-Mixed, Call-Wall Reactor, University of Colorado at Bolder (2000)Google Scholar
2. Berger, Harvey L., Ultrasonic Liquid Atomization, Theory and Application, Partridge Hill Publishers. Sono-Tek (1998)Google Scholar
3. Krumdieck, S. and Raj, Rishi, Conversion Efficiency of Alkoxide Precursor to Oxide Films Grown by an Ultrasonic-Assisted, Pulsed Liquid Injection Metalorganic Chemical Vapor Deposition (Pulsed-CVD) Process, Journal of American Ceramic Society 82 (1999)Google Scholar
4. Bowers, W.D., Chuan, R.L., and Duong, T.M., A 200 MHz surface acoustic wave resonator mass microbalance.Femtometrics (1991)Google Scholar
5. Drafts, Bill, Acoustic Wave Technology Sensors, Microsensor Systems Inc.Google Scholar