Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-28T16:08:19.705Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization of Large Particles in Fumed Silica Based CMP Slurry

Published online by Cambridge University Press:  01 February 2011

W. Scott Rader ,
Timothy Holt  and
Kazusei Tamai
W. Scott Rader
Affiliation:
[email protected], Fujimi Corporation, Tualatin, Oregon, United States
Timothy Holt
Affiliation:
[email protected], Fujimi Corporation, Tualatin, Oregon, United States
Kazusei Tamai
Affiliation:
[email protected], Fujimi Incorporated, Nagoya, Japan
Get access

Abstract

Large particles in fumed silica dispersions were characterized by sedimentation, light scattering techniques, Transmission Electron Microscopy (TEM), and lacunarity. Applying centrifugation to fumed silica dispersions generated differences in sedimentation rates of large particles. The sedimentation rates of the large particles were affected by morphological differences and the particles remaining in the supernatant displayed buoyant behavior. The large particle morphology varied from branch like aggregates containing large primary particles to particles comprised of highly coalesced, tightly packed small primary particles. The results indicate the presence of different types of large particles in fumed silica dispersions to which conventional large particle characterization is unable to distinguish.

Keywords

slurrynanostructuremorphology
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-E04-08
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Remsen, E. Anjur, S. Boldridge, D. Camiti, M. Li, Shoutian, Johns, T. Dowell, C. Kasthurirangan, J. Feeney, P. J. Electrochem. Soc., 153, G453–461, (2006)Google Scholar
2 Tamai, K. Akatsuka, T. Morinaga, H. Doi, T. Kurakawa, S. ICPT Proceedings, 296–300 (2009)Google Scholar
3 Rader, W. Tamai, K. Tupper, J. Suzuki, K. CMP Users Group, Northern California Section of the American Vacuum Society, Proceedings, December (2001)Google Scholar
4 Rader, W. Tamai, K. Suzuki, K. International Symposium on Chemical-Mechanical Planarization, CAMP Proceedings, 4, (1999)Google Scholar
5 Rader, W. Lin, J. Holt, T. International Symposium on Chemical-Mechanical Planarization, CAMP Proceedings, 12, (2007)Google Scholar
6 Hyeon-Lee, J., Beaucage, G. Pratsinis, S. Vermury, S. Langmuir, 14, 5751–5756 (1998)Google Scholar
7 Bolridge, D. Aerosol Sci. and Tech, 44–3, 182–186 (2010)Google Scholar
8 Gregory, J. Wat. Sci. Tech 36–4, 1–13, (1997)Google Scholar