Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-12-01T09:00:50.950Z Has data issue: false hasContentIssue false
  • English
  • Français

Characterization and Soldering of Organic Modified Aluminum Thin Films and Bond Pads

Published online by Cambridge University Press:  21 March 2011

Rui Fang ,
Eric Dahlgren ,
Matthew J. O'Keefe ,
Thomas J. O'Keefe ,
Wu-Sheng Shih ,
Daniel R. Gamota  and
Jie Zhang
Rui Fang
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409
Eric Dahlgren
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409
Matthew J. O'Keefe
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409
Thomas J. O'Keefe
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409
Wu-Sheng Shih
Affiliation:
Brewer Science, Rolla, MO 65401
Daniel R. Gamota
Affiliation:
Motorola Advanced Technology Center, Schaumburg, IL 60196
Jie Zhang
Affiliation:
Motorola Advanced Technology Center, Schaumburg, IL 60196
Get access

Abstract

An immersion plating process using organic solutions was used to deposit a seed layer of copper and to activate the surface of thin film aluminum surfaces and bond pads. The seeded surfaces were subsequently electroless copper plated and tested for compatibility with soldering assembly. It was demonstrated that the copper particles deposited from the organic solution onto sputter deposited aluminum thin films were able to act as nucleation sites for the subsequent build up of adherent, continuous copper films from conventional electroless plating baths. In addition, the metal deposition from organic solution process was found to be very selective on patterned test vehicles and integrated circuits as metal deposition occurred only on the exposed aluminum bond pads and not on any passivated surfaces. Tests were conducted to determine the solderability of the samples after only seeding in the organic solution as well as the combination of seeding plus electroless copper deposition. In these tests, all attempts to directly solder without any pre-treatment were unsuccessful. Results on solder adherence varied with different substrates. Nevertheless, the concept of depositing metal seed layers in these applications is feasible. Additional work is needed, however, to optimize the deposition process for each particular surface to be soldered.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 682: Symposium N – Microelectronics and Microsystems Packaging , 2001 , N2.8
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Teo, P. S., Huang, Y-W., Tung, C. H., Marks, M. R., and Lim, T. B. in Proc. Electron. Compon. Technol. Conf., 50th (2000) pp.33–59.Google Scholar
2. Tan, Q., Beddingfield, C., Mistry, A., and Mathew, V. in IEEE/CPMT Int. Electron. Manuf. Technol. Symp., 23rd (1998) pp.34–40.Google Scholar
3. O'Keefe, T. J., Stroder, M., O'Keefe, M. J. in Advance Interconnects and Contact Materials and Processes for Future Integrated Circuits, edited by Murarka, S. P., Fraser, D. B., Eizenberg, M., Tung, R., and Madar, R., (Mater. Res. Soc. Proc. 514, Warrendale, PA, 1998) pp.473–477.Google Scholar
4. O'Keefe, M. J., Leedy, K. D., Grant, J. T., Fang, M., Gu, H., and O'Keefe, T. J., J. Vac. Sci. Tech. B 17(5), 2366 (1999).Google Scholar
5. Fang, M., O'Keefe, T. J., Stroder, M., Shih, W., O'Keefe, M. J., Strawser, R., and Via, D. in Electronic Packaging Materials Science X, edited by Belton, D. J., Gaynes, M., Jacobs, E. G., Pearson, R., and Wu, T., (Mater. Res. Soc. Sym. Proc. 515, Warrendale, PA, 1998) pp. 85–90.Google Scholar
6. Fang, R., Gu, H., O'Keefe, M. J., O'Keefe, T. J., Shih, W-S., Leedy, K. D., and Cortez, R., J. Electron. Mater., 30(4) (2001).Google Scholar